Semiconductor Package Sealing Structure for Under-Board Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor devices face challenges in efficiently dissipating heat due to inadequate thermal management, leading to potential damage and reduced performance of semiconductor components.

Innovation Solution

A semiconductor device design featuring a cooling module with a heat dissipation base and a sealing member that exposes the lower surface of the semiconductor module, creating an under-board space and lateral spaces to enhance thermal conductivity through an adhesive member that connects the module to the cooling module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the lower surface of the semiconductor module is sealed by the sealing member, then the semiconductor device has a compact structure, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvestructure compactnessVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The sealing member is divided into an upper sealing portion and a lower sealing portion that are separated in the vertical direction. The lower sealing portion has an opening that exposes the lower surface of the board, creating under-board space and lateral spaces. This segmentation allows the structure to maintain compactness while providing dedicated pathways for heat dissipation beneath the board.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention creates three-dimensional under-board space and lateral spaces by utilizing the vertical dimension beneath the board. The opening in the lower sealing portion allows heat to be dissipated in the downward direction (under-board space) and laterally (lateral spaces), adding thermal management capabilities in multiple spatial dimensions rather than only in the planar direction.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the lower surface of the board is exposed to improve heat dissipation, then thermal management is enhanced, but the sealing structure becomes more complex

Engineering Contradiction:

Improvethermal managementVSAvoidsealing structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The upper sealing portion and lower sealing portion are merged into a single integrated sealing member that performs both sealing and heat dissipation functions. The opening in the lower sealing portion is designed to naturally form under-board space and lateral spaces, combining the sealing function with the heat dissipation structure rather than requiring separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The sealing member serves multiple functions: it seals the upper and side surfaces of the board, creates under-board space for heat dissipation, forms lateral spaces for thermal management, and provides structural support. This multi-functionality reduces the need for additional separate components despite the enhanced thermal management requirements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If adhesive member is used to connect semiconductor module to cooling module, then thermal conductivity is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidassembly precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The adhesive member is applied in advance to the lower surface of the board before assembly with the cooling module. The opening structure in the sealing member allows the adhesive to be pre-applied and positioned correctly, ensuring proper thermal contact between the semiconductor module and cooling module while maintaining manufacturing feasibility.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves thermal conductivity and reduces the risk of damage by effectively dissipating heat, maintaining component integrity and performance.

Implementation Method 1

enhance thermal conductivity through an adhesive member that connects the module to the cooling module

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

efficiently dissipating heat, maintaining component integrity and performance

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20260033377A1Semiconductor device and method of manufacturing the same

Publication Date: 2026.01.29 FUJI ELECTRIC CO LTD

AI summary

A semiconductor device, including: a board having an upper surface, a lower surface, and a side surface; and a sealing member having a lower surface and an opening in the lower surface thereof, the opening having an inclined side surface therein, the sealing member sealing the upper surface and the side surface of the board, leaving the entire lower surface of the board exposed from the opening, so as to form: an under-board space directly below the lower surface of the board, and a lateral space directly below the inclined side surface of the opening, and continuous with the under-board space.