Semiconductor Package Layout for Underfill Overflow Control
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Solution Overview
Problem
The integration of electronic IC and photonic IC in silicon photonics results in long transmission paths, which can lead to underfill overflow in small gaps, adversely affecting device performance.
Innovation Solution
A semiconductor device package design featuring a carrier with side-by-side components and a protective element with angled, differently protruding portions to manage underfill overflow, utilizing conductive connection elements for precise alignment and a protective material distribution to prevent component contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the distance between electronic IC and photonic IC is reduced, then transmission path length is shortened, but underfill may overflow and adversely affect device performance
Solution Approach 1:
A protective element is introduced as an intermediary component between the electronic IC and photonic IC. This protective element extends from the space under one component toward the space under the other component, acting as a barrier that prevents underfill overflow from reaching and damaging the components, thereby enabling shorter distances without compromising reliability
Solution Approach 2:
The protective element is positioned in advance to counteract the potential harmful effect of underfill overflow. By having the protective element already in place before underfill application, the system preemptively blocks the harmful action of underfill from reaching the components, allowing for reduced spacing while maintaining device performance
Data Source
AI summary
A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.