Semiconductor Package Underfill Guide Structure for Compact Reliability
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device design with a substrate having conductive structures and a guide structure that guides an underfill material between the electronic component and the substrate, enhancing electrical coupling and protection while optimizing package size and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost is high and reliability is decreased
Solution Approach 1:
The package structure is divided into distinct functional segments: a substrate providing mechanical support and electrical connections, an electronic component mounted on the substrate, and an underfill material filling the gap between them. This segmentation allows each component to be optimized independently for its specific function, improving overall reliability while maintaining manufacturing feasibility.
Solution Approach 2:
The underfill material is applied before final packaging completion, preliminarily establishing mechanical and environmental protection for the electronic component-substrate assembly. This preliminary action prevents void formation and ensures proper stress distribution before the component is fully enclosed, enhancing reliability without requiring complex post-assembly processes.
2Volume of moving object
If conventional semiconductor packages are used, then manufacturing processes are traditional, but package size is too large
Solution Approach 1:
The electronic component is nested within the substrate assembly, with the underfill material nested in the gap between the component and substrate. This nested configuration maximizes space utilization, allowing the package to achieve compact dimensions without compromising the structural integrity or electrical performance of individual components.
Solution Approach 2:
The use of underfill material changes the mechanical and thermal parameters of the package assembly. The underfill provides stress relief and thermal management, enabling smaller package dimensions by improving the structural efficiency and heat dissipation capability of the compact assembly.
3Reliability
If conventional semiconductor packages are used, then design is simpler, but performance is relatively low
Solution Approach 1:
The underfill material serves as an intermediary between the electronic component and substrate, providing mechanical bonding, stress relief, and thermal management. This intermediary enhances electrical coupling reliability by ensuring stable mechanical contact and reducing thermal expansion mismatches, without requiring complex conductive pathways or additional connection structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more reliable, cost-effective, and compact semiconductor package with improved electrical coupling and environmental protection.
Implementation Method 1
forming an underfill using the guide structure to guide the underfill extending underneath the electronic component
Data Source
AI summary
In one example, a semiconductor device includes a substrate comprising a conductive structure including internal terminals over a substrate first side and external terminals over a substrate second side coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side. An underfill is interposed between the electronic component second side and the substrate first side and is over the guide structure.