Semiconductor Package Uneven Interface Adhesion
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Solution Overview
Problem
Semiconductor packages face reliability issues due to thermal stress between dissimilar materials, particularly around the underbump metallurgy (UBM) layer, leading to potential delamination and cracking, which affects the package's performance and longevity.
Innovation Solution
The introduction of unevenness surfaces with increased surface roughness at the interfaces between the passivation layer and the UBM layer, and between the passivation layer and the redistribution layer, enhances adhesion and prevents stress propagation, thereby improving the package's reliability by increasing the contact area and blocking stress propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If smooth interfaces are used between passivation layer and UBM layer, then manufacturing process is simple, but adhesion is insufficient and thermal stress causes delamination and cracking
Solution Approach 1:
The patent applies local quality by creating unevenness surfaces with increased surface roughness specifically at the interfaces between the passivation layer and UBM layer, and between the passivation layer and redistribution layer. This localized modification enhances adhesion strength at critical stress points without complicating the entire device structure, resolving the contradiction between reliability and device complexity.
2Reliability
If smooth interfaces are used between passivation layer and redistribution layer, then manufacturing process is simple, but thermal stress propagation causes cracking
Solution Approach 1:
The patent applies local quality by creating unevenness surfaces with increased surface roughness specifically at the interfaces between the passivation layer and UBM layer, and between the passivation layer and redistribution layer. This localized modification enhances adhesion strength at critical stress points without complicating the entire device structure, resolving the contradiction between reliability and device complexity.
3Reliability
If increased surface roughness is applied at interfaces, then adhesion is enhanced and stress propagation is blocked, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by modifying the surface roughness parameter at specific interfaces to enhance adhesion and block stress propagation. By controlling the surface roughness of the unevenness surfaces, the patent improves package reliability while managing the associated manufacturing precision requirements through defined parameter ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The unevenness surfaces effectively enhance adhesion and prevent cracking, leading to improved reliability and reduced stress propagation, thus enhancing the overall performance and longevity of the semiconductor package.
Implementation Method 1
An interface between the passivation layer and the plurality of UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer
Data Source
AI summary
A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.