Semiconductor Package Venting Channel for Pop-Corn Lid Detachment
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Solution Overview
Problem
Semiconductor device packages face detachment issues due to the 'pop-corn effect' during thermal cycles, where the lid separates from the substrate due to expansion or movement, compromising the package's integrity and reliability.
Innovation Solution
Incorporating a supporting element with a transparent plate and a lid that define a channel, which includes a gap or recess to accommodate adhesive bleeding and provide an air venting path, mitigating light, water, and particle leakage while preventing lid detachment. This design ensures the lid remains secure during thermal cycles by allowing vapor or moisture release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lid is glued to the substrate to form a sealed package, then the package is protected from moisture, dust, and particles, but the lid may detach due to the pop-corn effect during thermal cycles
Solution Approach 1:
The patent divides the sealing structure into multiple components: the lid, the substrate, and an intermediate adhesive layer. By segmenting the sealing function across these components with the adhesive layer acting as a compliant interface, the structure can accommodate thermal expansion differences while maintaining the seal, preventing lid detachment during thermal cycles
Solution Approach 2:
The patent modifies the physical parameters of the adhesive layer by selecting materials with specific properties (viscosity, elasticity, thermal expansion coefficient) that allow the adhesive to flow and accommodate the pop-corn effect during thermal cycling, thereby maintaining both seal integrity and preventing detachment
2Object-affected harmful factors
If the lid is sealed tightly to the substrate, then light leakage is prevented, but adhesive bleeding compromises the seal and causes detachment
Solution Approach 1:
The patent extracts the adhesive bleeding issue from the sealing critical path by providing dedicated containment features (grooves, channels, or recesses) that capture and isolate the adhesive, allowing the main sealing interface to remain clean and precise while still accommodating adhesive flow during manufacturing
3Object-affected harmful factors
If the package is completely sealed, then particle contamination is prevented, but vapor and moisture cannot escape causing internal pressure buildup
Solution Approach 1:
The patent applies different sealing qualities to different regions of the package: the majority of the lid-substrate interface maintains a tight seal to prevent particle contamination, while specific localized regions incorporate vent channels or breathable adhesive sections that allow vapor and moisture to escape, balancing contamination protection with pressure relief
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents lid detachment during thermal cycles by creating a venting channel that accommodates adhesive flow and maintains package integrity, reducing light leakage and particle contamination, thus enhancing the reliability and stability of semiconductor device packages.
Implementation Method 1
the lid may be detached from the substrate due to a pop-corn effect (e.g. expansion or movement due to heat) resulting from thermal cycles
Data Source
AI summary
A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.