Semiconductor Package Vertical Bonding for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the miniaturization of electronic products, heat dissipation and antenna efficiency become significant issues due to the challenges of effectively bonding semiconductor device packages to board structures while minimizing area usage and enhancing transmission performance.
Innovation Solution
A semiconductor device package design featuring a connection element partially encapsulated by an encapsulant, with a portion exposed from the upper surface and edge, allowing vertical bonding to a board structure, which reduces contact area, improves heat dissipation, and increases transmission performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the semiconductor device package is bonded to the board structure with a large contact area, then the bonding strength is improved, but the board area is increased and heat dissipation is reduced
Solution Approach 1:
The connection element transitions from a planar configuration to a three-dimensional structure with vertical extension. The exposed portion of the connection element protrudes from the upper surface and edge of the encapsulant, enabling vertical bonding to the board structure. This dimensional change allows bonding strength to be achieved through vertical contact rather than horizontal area, thereby reducing the board area occupied while maintaining or enhancing bonding strength.
2Area of stationary object
If the contact area between the semiconductor device package and the board structure is reduced, then the board area is saved, but the bonding strength is reduced
Solution Approach 1:
The connection element is configured to extend vertically with an exposed portion that protrudes from the encapsulant. This vertical extension compensates for the reduced horizontal contact area by providing substantial bonding surface in the vertical dimension, thereby maintaining bonding strength while minimizing board area occupation.
Solution Approach 2:
The connection element appears to be composed of multiple materials or structures, including conductive materials for electrical connection and potentially reinforcing materials for mechanical strength. This composite construction enables the exposed portion to achieve both electrical connectivity and mechanical bonding strength with minimal board area contact.
3Temperature
If the contact area is minimized for heat dissipation, then heat dissipation efficiency is improved, but the bonding strength is reduced
Solution Approach 1:
The vertical extension of the connection element separates the bonding function from the heat dissipation function. The minimal horizontal contact area reduces heat transfer to the board, improving heat dissipation efficiency, while the vertical exposed portion provides sufficient bonding strength through vertical attachment to the board structure.
4Reliability
If the connection element is fully encapsulated, then the encapsulation completeness is improved, but the vertical bonding capability is lost
Solution Approach 1:
The encapsulant is configured to cover and protect most of the connection element, providing reliable encapsulation and protection. However, a specific local region of the connection element is left exposed, creating a functional zone for vertical bonding. This local differentiation maintains encapsulation completeness for protection while enabling vertical bonding capability where needed.
Solution Approach 2:
Instead of fully encapsulating the connection element, the design applies partial encapsulation, leaving a portion exposed. This partial action is sufficient to provide the necessary protection and reliability while preserving the vertical bonding functionality that would be lost with complete encapsulation.
Data Source
AI summary
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.