Semiconductor Package Structure With Vertical Interconnects
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in improving electrical efficiency at high frequencies due to high impedance caused by long wiring and are complex to fabricate, leading to increased costs and complexity in packaging.
Innovation Solution
A semiconductor package structure and method involving a substrate with insulating layers and metal layers, where die pads are exposed and coupled through metal layers with insulating spacing to reduce impedance and simplify the packaging process, including the use of multiple insulating and metal layers to facilitate efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional wire bonding and lead frame structures are used, then high pin count can be achieved, but electrical efficiency deteriorates at high frequencies due to high impedance from long wiring
Solution Approach 1:
The patent transitions from planar wire routing to three-dimensional vertical interconnections using through-substrate vias and stacked metal layers. This dimensional change shortens current paths and reduces impedance while maintaining high pin count capability through vertical stacking of connection points.
Solution Approach 2:
The patent divides the continuous wire path into segmented metal layers and insulating layers, creating a distributed via structure. This segmentation allows for optimized local impedance control and reduced overall wiring length by routing signals through multiple short vertical segments rather than one long horizontal path.
2Reliability
If conventional wire bonding and encapsulation processes are used, then die protection is achieved, but fabrication complexity increases significantly
Solution Approach 1:
The patent merges the die attachment, wire bonding, and encapsulation processes into a single integrated substrate mounting structure. The substrate serves simultaneously as mechanical support, electrical interconnection medium, and protective enclosure, eliminating separate fabrication steps for each function.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: providing mechanical support for the die, establishing electrical connections through integrated metal traces and vias, and offering environmental protection through its encapsulating structure. This multi-functionality reduces the number of separate components and assembly steps required.
3Ease of operation
If conventional lead frame or circuit board structures are used, then die carrying and wiring are enabled, but package cost increases due to additional components
Solution Approach 1:
The substrate is designed as a multi-functional component that simultaneously provides mechanical support for die mounting, electrical interconnection through integrated traces and vias, and structural protection. By consolidating these functions into a single component, the patent eliminates the need for separate lead frames or circuit boards, thereby reducing material costs and assembly complexity.
Solution Approach 2:
The patent combines the functions of die attachment substrate, wiring interconnect, and protective housing into a single integrated substrate structure. This consolidation eliminates redundant components and reduces the total bill of materials, directly lowering package cost while maintaining all necessary functionalities.
Data Source
AI summary
The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second die pad, the first die pad coupled to a first portion of a metal layer, the second die pad coupled to a second portion of the metal layer, and the first portion of the metal layer and the second portion of the metal layer spaced apart by a second insulating layer. An associated semiconductor packaging method and another semiconductor package structure are also disclosed.