Semi-hermetic semiconductor package with vertical protrusion seal
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Solution Overview
Problem
Hermetic semiconductor packages face challenges in effectively reducing moisture ingress, which can compromise the reliability and performance of semiconductor devices, especially in applications requiring high reliability and stress sensitivity.
Innovation Solution
The design incorporates a package substrate with vertically oriented end protrusions that extend into gaps filled with adhesive or thermoplastic material, elongating the moisture travel path and enhancing the seal within the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional hermetic seal is used, then moisture protection is provided, but moisture ingress can still compromise reliability in high-performance applications
Solution Approach 1:
The patent introduces vertical protrusions extending into the seal cavity, transforming the traditional planar seal interface into a three-dimensional structure. This dimensional change creates multiple sequential barrier layers (adhesive material, protrusion surfaces, cavity walls) that moisture must penetrate, significantly increasing the moisture travel path length and reducing ingress rates without compromising seal integrity.
Solution Approach 2:
The seal structure is segmented into multiple functional zones: the base adhesive material layer, the vertical protrusion elements, and the cavity confinement regions. This segmentation creates multiple independent barrier interfaces that collectively enhance moisture resistance, where each segment contributes to the overall hermetic performance through its specific geometric and material properties.
2Ease of manufacture
If epoxy seal is used, then semi-hermetic protection is achieved, but moisture ingress rate is higher compared to hermetic seals
Solution Approach 1:
The patent employs a composite sealing system combining epoxy adhesive material with geometric barrier structures (vertical protrusions and sealed cavities). This composite approach leverages the manufacturing ease and bonding capabilities of epoxy while introducing physical barrier elements that dramatically reduce moisture ingress, achieving hermetic-level protection through material-geometry integration rather than relying on epoxy properties alone.
3Temperature
If ceramic packages are used, then high temperature and stress sensitivity are handled well, but complex sealing structures are required
Solution Approach 1:
The patent applies local quality enhancement by concentrating sealing functionality in specific critical regions (vertical protrusions at seal interfaces, cavity confinement zones) rather than requiring complex structures throughout the entire package. This localized approach maintains thermal and mechanical performance while minimizing overall structural complexity, using simple geometric features placed strategically to maximize moisture barrier effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces moisture ingress into the package, providing a more reliable and durable seal that enhances the performance and longevity of semiconductor devices by creating a longer path for moisture to travel, thus increasing the resistance to moisture flow.
Implementation Method 1
a lid which includes vertically oriented end protrusions upon placement so that the end protrusions are in the gaps that have adhesive or thermoplastic material secures the protrusions within the adhesive or thermoplastic material
Implementation Method 2
Disclosed wall designs elongate (lengthen) the moisture travel path into the semiconductor package to reduce the moisture ingress rate into the package
Data Source
AI summary
A method of assembling a semi-hermetic semiconductor package includes bonding a semiconductor die having bond pads to a top side of a base region of a package substrate having vertical side walls that are hollow which define an inner open volume (gap) having an adhesive or thermoplastic material therein. There are a plurality of metal terminals providing top terminal contacts on the top side of the base region and bottom terminal contacts on a bottom side or below the base region. The bond pads are coupled to the top terminal contacts. A lid is placed which provides a top for the semiconductor package, where the lid extends to vertically oriented end protrusions so that the protrusions are positioned within the adhesive or thermoplastic material to secure the protrusions within the adhesive or thermoplastic material to provide a seal for the semiconductor package.