3D Semiconductor Package Vertical Stacking for Miniaturization
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Solution Overview
Problem
Conventional semiconductor packages are limited in size reduction and multi-functionality due to the need for a sizable printed circuit board to accommodate active and passive devices, hindering the miniaturization and high-speed operation of electronic products.
Innovation Solution
A three-dimensional (3D) system-in-package (SIP) semiconductor package structure is developed, featuring vertically stacked electronic components with a molding compound and conductive layers, allowing for heterogeneous integration and increased device density, with multiple components of different functions and sizes integrated in a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages place active and passive devices on a printed circuit board, then devices can be mounted and connected, but the package size becomes large and miniaturization is hindered
Solution Approach 1:
The patent transitions from a conventional two-dimensional planar arrangement of devices on a PCB to a three-dimensional vertical stacking configuration. Multiple semiconductor devices are stacked vertically and connected through through-silicon vias (TSVs), enabling space utilization in the vertical dimension. This dimensional change dramatically reduces the lateral footprint and overall package size while maintaining all necessary electrical connections and device functionality.
Solution Approach 2:
The patent implements a nested structure where multiple semiconductor devices are stacked one on top of another, with each device nested within the vertical space occupied by the package. The devices are interconnected through TSVs that pass through intermediate devices, creating a nested configuration where devices are embedded within the vertical stack. This nesting approach maximizes device density within a compact volume.
2Area of stationary object
If a sizable PCB is used to accommodate active and passive devices, then multi-pin connection and functionality are provided, but the area occupied increases and electronic product miniaturization is difficult
Solution Approach 1:
The patent utilizes the vertical dimension to provide multiple pin connections and functional interfaces. TSVs extend vertically through the stacked devices, providing numerous electrical connection points without increasing the lateral package area. This vertical interconnection approach enables multi-pin functionality while maintaining a compact footprint suitable for miniaturized electronic products.
Solution Approach 2:
The patent segments the package into multiple functional layers or stacks, where each stacked device can perform different functions (active devices, passive devices, interconnect layers). This segmentation allows diverse functionality to be distributed across the vertical stack, with each segment contributing to the overall multi-functional capability without requiring additional lateral space.
3Volume of moving object
If devices are stacked vertically to reduce package size, then miniaturization is achieved, but manufacturing complexity and alignment precision requirements increase
Solution Approach 1:
The patent employs preliminary alignment features and pre-formed TSV structures that are created during device fabrication before stacking. Alignment marks, protrusions, or guide structures are incorporated into the devices during manufacturing, enabling precise alignment during the stacking process. This preliminary preparation reduces the alignment precision requirements during final assembly and simplifies the manufacturing process.
Solution Approach 2:
The patent introduces intermediary elements such as underfill materials, adhesive layers, or alignment fixtures that facilitate precise stacking and bonding of devices. These intermediary components compensate for minor misalignments and provide a buffer that reduces the stringency of alignment requirements during the stacking process, thereby simplifying manufacturing while maintaining vertical integration benefits.
Data Source
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AI summary
A semiconductor package structure is provided. The semiconductor package structure includes a first electronic component on a substrate. The semiconductor package structure also includes a second electronic component stacked on the first electronic component. The active surface of the first electronic component faces the active surface of the second electronic component. The semiconductor package structure further includes a molding compound on the first electronic component and surrounding the second electronic component. In addition, the semiconductor package structure includes a third electronic component stacked on the second electronic component and the molding compound.