Semiconductor Package Via-Coupled Power Transistors

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Solution Overview

Problem

Conventional voltage converter packages face challenges in accommodating thin power transistors due to the limitations of conductive clips and large heat spreaders, which affect electrical resistance and heat management, leading to impaired performance and increased size.

Innovation Solution

The integration of a conductive lead frame with solder-filled laser vias provides a robust, low-resistance electrical connection and thermal protection, eliminating the need for a discrete heat spreader, allowing for a compact package design by using the carrier as both a structural support and integrated heat spreader.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive clip is used to connect control and sync transistors, then electrical connection is provided, but the cross-sectional area must be relatively large to accommodate high current and reduce electrical resistance

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidconductive clip area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the heat spreader and conductive clip into a single integrated component. The conductive clip is thermally coupled to the heat spreader, allowing it to serve dual functions: providing robust electrical connection between transistors and acting as a heat dissipation path. This integration eliminates the need for separate heat spreader and conductive clip components, reducing overall package size while maintaining electrical reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive clip is designed to perform multiple functions simultaneously: it provides electrical connection between control and sync transistors, serves as a heat sink for the transistors, and acts as a structural support element. This multi-functionality allows the component to maintain high current carrying capacity and thermal management performance without requiring increased size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a dedicated heat spreader is used for thermal protection, then heat management is improved, but the heat spreader must be relatively large, increasing package size

Engineering Contradiction:

Improvethermal protectionVSAvoidheat spreader area

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent integrates the heat spreader functionality into the existing conductive clip and carrier structure. The conductive clip is thermally coupled to the heat spreader, creating a unified thermal management system that eliminates the need for a separate, large dedicated heat spreader. The heat dissipation function is distributed across multiple components rather than requiring a single large heat spreader.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If large conductive clip and heat spreader are used, then electrical and thermal performance is maintained, but the package size must be increased to accommodate all components

Engineering Contradiction:

Improveelectrical and thermal performanceVSAvoidpackage volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent combines multiple discrete components (conductive clip, heat spreader, carrier) into an integrated assembly where the conductive clip is thermally coupled to the heat spreader, and both are mounted on the carrier. This integration reduces the total package volume by eliminating gaps and inter-component connections while maintaining all necessary electrical and thermal performance characteristics.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables a compact semiconductor package design with reduced thickness, providing reliable electrical and thermal performance while eliminating the need for a separate heat spreader, thus enhancing switching performance and reducing package size.

Implementation Method 1

solder-filled laser vias provides a robust, low-resistance electrical connection and thermal protection

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

conductive lead frame with solder-filled laser vias provides a robust, low-resistance electrical connection

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9496168B2Semiconductor package with via-coupled power transistors

Publication Date: 2016.11.15 INFINEON TECHNOLOGIES AMERICAS CORP

AI summary

In one implementation, a semiconductor package includes a carrier including first and second conductive segments, and first and second transistors attached respectively to the first and second conductive segments. The semiconductor package also includes a dielectric material formed in exposed portions of the first and second conductive segments, a first via extending through the dielectric material to the first conductive segment, and a second via extending through the dielectric material to the second conductive segment. A solder material fills each of the vias, the solder material protruding beyond the dielectric material and configured to electrically, thermally, and mechanically connect the carrier to a mounting surface for the semiconductor package.