Semiconductor Package with Via-Plugs and Heat-Sink
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Solution Overview
Problem
The increasing demand for high integration and miniaturization in semiconductor packages poses a challenge due to higher manufacturing costs, necessitating a cost-effective solution for high-density system integration in a single package.
Innovation Solution
The semiconductor package design incorporates a substrate with multiple pads, conductive elements, surface mount devices, bonding wires, and a heat-sink, along with via-plugs and solder resistance layers to facilitate miniaturization and enhance design flexibility by creating additional space for components and improving routing density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high integration is implemented to reduce package size, then miniaturization is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple device components including semiconductor die, surface mount devices, and interconnection structures into a single integrated package substrate. This merging of components into one unified structure achieves high-density integration while maintaining cost-effectiveness through standardized manufacturing processes rather than requiring complex multi-step assembly of separate packages.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support, electrical interconnection through conductive elements and vias, thermal management through heat sink integration, and component mounting surfaces. This multi-functionality reduces the need for separate components and assemblies, thereby reducing overall manufacturing cost while achieving miniaturization.
2Productivity
If multiple device components are integrated in a single package, then system integration density increases, but manufacturing complexity increases
Solution Approach 1:
The patent divides the integrated package into distinct functional layers and regions: active device mounting areas, passive component areas, interconnection layers with conductive elements, and heat dissipation zones. This segmentation allows each region to be optimized independently while maintaining overall integration, simplifying the manufacturing process by enabling modular assembly techniques.
Solution Approach 2:
The patent utilizes three-dimensional vertical stacking of conductive elements, vias, and multiple device components within the package substrate. By transitioning from two-dimensional planar integration to three-dimensional vertical integration, the system achieves higher integration density without proportionally increasing manufacturing complexity, as the additional dimension can be addressed through standardized layering processes.
3Productivity
If via-plugs are used to electrically connect pads, then routing density improves, but manufacturing steps increase
Solution Approach 1:
The via-plugs are formed during the substrate fabrication process before final component assembly, establishing electrical interconnection pathways in advance. This preliminary formation of conductive vias integrated into the substrate manufacturing flow allows for high routing density to be achieved without adding significant manufacturing steps, as the vias are created as part of the base substrate structure rather than as separate post-processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates miniaturization of IC packages, increases extra area for additional elements or devices, and enhances design flexibility, thereby reducing manufacturing costs and improving integration density.
Implementation Method 1
The heat-sink is mounted on the substrate and has at least one cavity to accommodate the first pad, the second pad, a portion of the first conductive element, the bonding wire and the surface mount device
Implementation Method 2
The heat-sink is mounted on the substrate and has at least one cavity
Implementation Method 3
The solder resistance layer covers a portion of the first bonding area and a portion of the second bonding area
Implementation Method 4
The first bonding wire electrically connects a first bonding area of the first conductive element with a second bonding area of the first pad
Data Source
AI summary
A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device and a connection element. The first conductive layer is formed on the substrate and has a first pad and a second pad separated from the first pad. The second conductive layer is formed on the substrate and has a third pad and a fourth pad electrically connected with the third pad through the second conductive layer. The first surface mount device is mounted on the first pad and the third pad. The second surface mount device is mounted on the second pad and the fourth pad. The connection element electrically connects the first pad with the second pad.