Semiconductor Package Via Segmentation for Misalignment Prevention
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Solution Overview
Problem
Semiconductor packages face electrical failures due to misalignment issues during the stacking process, which can lead to undesired contact and electrical shorts between power and ground vias.
Innovation Solution
The semiconductor package design includes grouped power and ground vias arranged in alternating regions, with increasing distances between them, which reduces the likelihood of misalignment-induced contact and electrical shorts, and uses connection terminals to ensure proper alignment and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If vias are arranged in alternating power and ground regions with small spacing to increase integration density, then device complexity is reduced and area is minimized, but misalignment during stacking causes undesired contact and electrical shorts between power and ground vias
Solution Approach 1:
The via structure is segmented into multiple types: first vias and second vias in alternating regions, third vias in intermediate regions between power and ground regions. This segmentation creates distinct electrical zones that prevent unintended connections while maintaining compact area utilization.
Solution Approach 2:
Third vias act as intermediary elements positioned in intermediate regions between power and ground regions. These intermediary vias serve as buffer zones that prevent direct contact between power and ground vias during stacking, eliminating the need for large spacing while ensuring electrical isolation.
2Reliability
If vias are arranged with large spacing between power and ground regions to prevent misalignment-induced contact, then electrical connection reliability is improved, but area increases and integration density decreases
Solution Approach 1:
The via structure is segmented into multiple types: first vias and second vias in alternating regions, third vias in intermediate regions between power and ground regions. This segmentation creates distinct electrical zones that prevent unintended connections while maintaining compact area utilization.
Solution Approach 2:
The problem is solved by adding a vertical dimension to the via arrangement. Multiple via layers (first, second, third vias) are stacked vertically at different positions, transforming a 2D spacing problem into a 3D structured solution that maintains both reliability and compact area.
3Ease of manufacture
If conventional wire bonding technique is used instead of TSV, then manufacturing complexity is reduced, but performance and speed are limited
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a TSV-based vertical interconnection system. This substitution eliminates the need for wire bonding while achieving superior electrical performance and signal transmission speed through direct vertical vias penetrating the substrate.
Data Source
AI summary
A semiconductor package includes a first die including a signal region and a peripheral region bordering the signal region and having first vias in the peripheral region, a second die stacked on the first die and having second vias at positions corresponding to the first vias in the peripheral region, and first connection terminals between the first die and the second die that are configured to connect the second vias to the first vias, respectively. The peripheral region includes first regions and second regions configured to transmit different signals, which are alternately arranged in a first direction. The first vias are arranged in at least two rows along a second direction intersecting the first direction in each of the first and second regions.