Thermally Conductive Vias and Channels in Semiconductor Packages
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Solution Overview
Problem
Semiconductor devices face heat buildup issues due to inefficient thermal conduction in organic materials, leading to potential malfunctions in stacked packages.
Innovation Solution
The formation of thermally conductive vias and channels around semiconductor dies, along with thermally conductive traces and pads, to effectively route heat away from the die, enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic encapsulant material is used around semiconductor die, then electrical insulation and physical support are provided, but thermal conduction is poor leading to heat buildup
Solution Approach 1:
The patent applies composite materials by combining organic encapsulant material with thermally conductive filler particles (such as aluminum oxide, aluminum nitride, or boron nitride) to create a hybrid material that maintains the electrical insulation properties of the organic material while gaining the thermal conduction capabilities of the inorganic filler particles. This composite encapsulant effectively transfers heat away from the semiconductor die, resolving the contradiction between needing electrical insulation and preventing heat buildup.
2Productivity
If stacked packages are used to increase density, then space efficiency is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces thermally conductive filler particles as intermediary elements within the organic encapsulant material. These filler particles act as thermal conduits that bridge the thermal gap between stacked semiconductor dies, enabling efficient heat transfer from upper dies to lower dies and ultimately to the substrate. This intermediary thermal conduction path allows stacked packages to maintain high density while effectively managing heat dissipation.
3Ease of manufacture
If conventional encapsulant material is used, then manufacturing is simple, but thermal management is insufficient
Solution Approach 1:
The patent modifies the thermal conduction parameter of the encapsulant material by incorporating thermally conductive filler particles with varying thermal conductivities, sizes, and distributions. By adjusting these parameters, the encapsulant's thermal conduction can be optimized for specific applications while maintaining the existing manufacturing process flow. The filler particles are integrated into the organic encapsulant during the molding process, requiring no additional manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from semiconductor devices, reducing the risk of malfunctions and improving the performance and reliability of semiconductor packages by enhancing thermal conduction.
Implementation Method 1
forming an electrically isolated and thermally conductive via in the encapsulant... forming a first thermally conductive trace over the active surface of the semiconductor die between the thermally conductive pad and the electrically isolated and thermally conductive via to route heat away from the semiconductor die
Data Source
AI summary
A semiconductor package includes a semiconductor die having contact pads. An encapsulant is disposed around the semiconductor die, and conductive vias are disposed in the encapsulant. Electrically conductive traces are disposed between the contact pads and conductive vias, a thermally conductive channel is disposed in the encapsulant separate from the conductive vias, and a thermally conductive layer is disposed over an area of heat generation of the semiconductor die. A thermally conductive trace is disposed between the thermally conductive layer and thermally conductive channel. The thermally conductive layer, thermally conductive trace, and thermally conductive channel are electrically isolated from the contact pads of the semiconductor die and the electrically conductive traces. The semiconductor package further comprises broad thermal traces disposed over the encapsulant, and a thermally conductive material interconnecting the broad thermal traces and the thermally conductive layer.