Semiconductor Package Marking for Visible Patterns on Translucent Layers
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Solution Overview
Problem
Existing semiconductor package marking methods struggle to enhance the visibility of marking patterns, particularly when using transparent or translucent photoimageable dielectric materials, as the visibility of the patterns is obscured by the underlying wiring layers.
Innovation Solution
The implementation of a semiconductor package design that includes a discolored area formed through laser annealing on the outermost insulating layer, with a marking pattern featuring step portions, which improves visibility by reducing the transparency of the layer and contrasting with surrounding regions, allowing the marking pattern to be clearly distinguished.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If transparent or translucent insulating layers are used to cover wiring layers, then the aesthetic appearance and light transmission are improved, but the visibility of marking patterns is reduced
Solution Approach 1:
The insulating layer is divided into different regions with different optical properties: a first region with higher transparency for light transmission and a second region with lower transparency for marking pattern visibility. This local differentiation allows each region to fulfill its specific function optimally.
Solution Approach 2:
The marking pattern region utilizes color contrast by creating a discolored area through laser annealing that differs in optical properties from the surrounding transparent insulating layer, enabling the marking pattern to be clearly visible against the translucent background.
2Loss of information
If laser annealing is performed to create a discolored area for improved marking visibility, then the visibility of identification information is enhanced, but additional manufacturing steps and process complexity are introduced
Solution Approach 1:
The laser annealing process that creates the discolored area is combined with or performed immediately before the marking pattern formation process. This integration reduces the number of separate manufacturing steps and simplifies the overall manufacturing complexity while achieving improved marking visibility.
Solution Approach 2:
The discolored area is created through laser annealing before the final marking pattern is applied. This preliminary preparation of the surface with different optical properties facilitates subsequent marking and ensures visibility without requiring additional post-processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the visibility of the marking pattern, even when embedded within transparent or translucent layers, by altering the optical properties of the insulating material, ensuring clear recognition of identification information such as manufacturing details and traceability.
Implementation Method 1
forming a discolored area by performing a laser annealing process on a surface of an outermost second insulating layer
Implementation Method 2
performing a laser annealing process to change a color of a region of the outermost second insulating layer
Implementation Method 3
forming a marking pattern including a step portion by performing a laser marking process on a surface of the outermost second insulating layer within the discolored area
Data Source
AI summary
A semiconductor package includes a first semiconductor chip; an encapsulant covering at least a portion of the first semiconductor chip; insulating layers provided on the encapsulant, each of the insulating layers being transparent or translucent; and wiring layers provided on the encapsulant, the wiring layers being partially covered by the insulating layers, wherein an outermost insulating layer of the insulating layers comprises a first region and a second region, a color of the first region is different from a color of the second region, the second region surrounds the first region, and at least one marking pattern comprising at least one step portion is provided in the first region of the outermost insulating layer.