Semiconductor Package Structure for Accurate Void Detection
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Solution Overview
Problem
Existing semiconductor devices face challenges in accurately detecting voids due to air trapped in the sealing resin body, which can lead to increased strain in the joining member and reduced connection reliability, as voids at the non-adhesive portion are not distinguishable from the peeled resin body using current detection methods.
Innovation Solution
A semiconductor device design featuring a metal member with an adhesive portion and a non-adhesive portion, where the non-adhesive portion has lower adhesion to the sealing resin body and an annular shape, allowing voids to be distinguished from the peeled resin body, enabling more accurate void detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a non-adhesive portion is placed at the peripheral portion of the metal member, then void detection accuracy is improved, but the sealing resin body adhesion is reduced
Solution Approach 1:
The peripheral portion of the metal member is divided into two regions with different adhesion properties: an adhesive portion that bonds to the sealing resin body and a non-adhesive portion that allows void detection. This local differentiation enables simultaneous achievement of strong sealing and accurate void detection by giving different functional qualities to different areas of the same component.
2Measurement precision
If the non-adhesive portion is placed closer to the mounting portion, then void detection is enabled, but the structural strength may be reduced
Solution Approach 1:
The non-adhesive portion is strategically positioned between the mounting portion and the adhesive portion, creating a localized detection zone that does not compromise the overall structural integrity. The adhesive portions maintain strong bonding at critical locations while the non-adhesive portion provides void detection capability in a less critical intermediate region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances void detection accuracy and reduces thermal stress on the solder, improving the reliability of the semiconductor device by ensuring that voids are not obscured by the peeled resin body, allowing for effective heat dissipation and reduced solder strain.
Implementation Method 1
an adhesive portion that may surround the mounting portion and adhere to the sealing resin body
Data Source
AI summary
A semiconductor device incudes: a semiconductor chip that includes an active area and an outer peripheral area surrounding the active area; a metal member that includes one face including a mounting portion on which the semiconductor chip is mounted and a peripheral member surrounding the mounting portion; a joining member that connects the semiconductor chip and the metal member; and a sealing resin body. The metal member includes, as the peripheral portion, an adhesive portion that surrounds the mounting portion and adheres to the sealing resin body, and a non-adhesive portion that is placed between the mounting portion and the adhesive portion. An entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.