Semiconductor Package Voids for Bonding Reliability
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving reliable bonding between connection conductors and pads due to limitations in miniaturization and weight reduction, leading to instability and potential connection failures.
Innovation Solution
Incorporating non-conductive films with strategically distributed voids between semiconductor chips, which undergo volume shrinkage during pressure bonding, ensuring a stable connection between upper and lower connection pads through the use of connection conductors like solder, and employing a molding member to enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are miniaturized and lightweight to meet user requirements, then device size and weight are reduced, but bonding reliability between connection conductors and pads deteriorates
Solution Approach 1:
The non-conductive film is designed with a porous structure containing voids having a volume fraction of 0.1 to 5 vol%. These voids allow the film to undergo controlled volume shrinkage during pressure bonding, improving contact between the connection conductor and pad while maintaining bonding reliability in miniaturized packages
Solution Approach 2:
The invention changes the physical parameters of the non-conductive film by controlling void size (1 μm to 100 μm average diameter) and volume fraction (0.1 to 5 vol%). During pressure bonding, these parameter changes enable the film to shrink and improve bonding pressure distribution, ensuring reliable connections in compact packages
2Reliability
If non-conductive films with voids are used to improve bonding reliability, then connection stability improves, but manufacturing complexity increases
Solution Approach 1:
The void characteristics (size, distribution, volume fraction) are controlled within specific ranges during film formation. This parameter control achieves reliable bonding without requiring complex post-processing, as the voids naturally collapse during pressure bonding to improve contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and bonding strength of semiconductor packages by maintaining a stable connection between conductors and pads, preventing overflow and ensuring efficient heat dissipation, thus enhancing the overall performance and durability of the semiconductor package.
Implementation Method 1
Incorporating non-conductive films with strategically distributed voids between semiconductor chips, which undergo volume shrinkage during pressure bonding
Data Source
AI summary
A semiconductor package includes a first semiconductor chip having a through-electrode and an upper connection pad on an upper surface of the first semiconductor chip that is connected to the through-electrode; a second semiconductor chip stacked on the first semiconductor chip, and having a lower connection pad on a lower surface of the second semiconductor chip; a non-conductive film between the first semiconductor chip and the second semiconductor chip, with the non-conductive film including voids having an average diameter of 1 μm to 100 μm, the voids having a volume fraction of 0.1 to 5 vol %; and a connection conductor that penetrates the non-conductive film and connects the upper connection pad and the lower connection pad.