Semiconductor Package Wall Structure for Optical Transceiver Protection
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Solution Overview
Problem
Existing semiconductor packages face challenges in minimizing optical loss and improving yield during fabrication.
Innovation Solution
A semiconductor package design featuring a wall structure around the transceiver that guides optical signals without distortion, combined with a method that includes a support structure and adhesive member to enhance fabrication precision and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transceiver is exposed through an opening in the mold layer for optical signal transmission, then optical signal transmission is enabled, but the transceiver becomes vulnerable to contamination and damage during fabrication
Solution Approach 1:
A wall structure is formed around the transceiver before the molding process, creating a protective enclosure that prevents contamination and damage during fabrication while allowing optical signal transmission through the exposed transceiver portion
2Object-affected harmful factors
If the wall structure is made tall to fully protect the transceiver, then protection is improved, but optical signal transmission is blocked
Solution Approach 1:
The wall structure is designed with selective height and positioning, providing full protection around the transceiver while leaving the optical signal transmission path open, achieving both protection and functionality through localized structural variation
3Object-affected harmful factors
If the wall structure is positioned close to the transceiver for maximum protection, then protection efficiency is improved, but fabrication precision requirements increase
Solution Approach 1:
The wall structure serves as an intermediary protective element that can be positioned at an optimal distance from the transceiver, balancing protection efficiency with relaxed fabrication precision requirements through its structural design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables optical signal transmission without loss and increases the yield of semiconductor packages by preventing contamination and damage during processing.
Implementation Method 1
guides optical signals without distortion
Implementation Method 2
irradiating light to separate the adhesive member and the support structure from the wall structure
Data Source
AI summary
According to some embodiments, a semiconductor package may include a first semiconductor chip; a second semiconductor chip disposed on a first semiconductor chip; a wall structure disposed on the first semiconductor chip and spaced apart from the second semiconductor chip in a first direction; and a mold layer covering the first and second semiconductor chips, wherein the first semiconductor chip includes a transceiver disposed thereon and spaced apart from the second semiconductor chip, the mold layer has an opening exposing the transceiver, the wall structure is disposed in the opening and is in contact with an inner wall of the mold layer exposed to the opening, the mold layer has a first height, and the wall structure has a second height smaller than the first height.