Semiconductor Package Assembly to Prevent Wafer Warpage
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Solution Overview
Problem
Conventional methods for forming electronic packages with stacked components using organic and inorganic materials with different thermal expansion coefficients are inadequate, leading to warpage deformation issues.
Innovation Solution
A semiconductor device manufacturing method that involves forming an interposer with a redistribution layer and dielectric layer, connecting contact structures, attaching a wafer support system, and encapsulating the semiconductor die, while arranging encapsulating processes to prevent warpage deformation due to thermal expansion coefficient mismatches, using techniques such as chemical vapor deposition and electroless plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If organic and inorganic materials with different thermal expansion coefficients are used in stacked components, then device functionality is achieved, but warpage deformation occurs
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the thermal expansion coefficients of different materials in the stacked structure. By adjusting material composition and thickness parameters, the patent achieves compatibility between organic and inorganic materials while minimizing warpage deformation during thermal cycling.
Solution Approach 2:
The patent utilizes composite materials by combining organic and inorganic materials with complementary properties in a stacked configuration. This composite approach enables the device to achieve desired functionality while managing thermal expansion differences through material selection and layer design.
2Ease of manufacture
If multiple processing steps are performed to form electronic packages, then device functionality is achieved, but warpage deformation occurs due to thermal expansion mismatches
Solution Approach 1:
The patent applies preliminary action by performing encapsulation processes at strategically selected stages during manufacturing. By encapsulating certain components before others, the patent prevents warpage deformation from occurring during subsequent processing steps, thereby maintaining manufacturing precision while enabling device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses warpage deformation by managing thermal expansion differences between semiconductor components, ensuring stable and reliable electronic package formation.
Implementation Method 1
using techniques such as chemical vapor deposition and electroless plating
Implementation Method 2
using techniques such as chemical vapor deposition and electroless plating
Data Source
AI summary
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.