Magnet-Embedded Semiconductor Package for Reflow Warpage Correction
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Solution Overview
Problem
Semiconductor packages are prone to warpage due to material and structural characteristics, particularly during high-temperature processes like reflow soldering, leading to electrical connection defects such as non-soldering or virtual soldering.
Innovation Solution
Incorporating magnets within the semiconductor package body, arranged to correspond with the warpage profile, which apply forces in response to an external magnetic field to correct warpage, ensuring effective contact between connection terminals and substrate pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering is performed to electrically connect the semiconductor package and external substrate, then electrical connection is achieved, but high-temperature warpage occurs causing connection defects
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning counterbalancing weights within the package structure before reflow soldering. These weights are strategically placed to generate forces that counteract the expected thermal expansion and warpage tendencies of the package components during the high-temperature reflow process, thereby preventing connection defects before they occur
Solution Approach 2:
The patent employs parameter changes by modifying the physical state and distribution of counterbalancing materials within the package. By adjusting the temperature, pressure, and spatial arrangement of these materials during manufacturing, the package's warpage characteristics are dynamically controlled to maintain optimal flatness during reflow soldering
2Productivity
If the vertical size of the semiconductor package is decreased and horizontal size is increased, then integration density is improved, but the degree of high-temperature warpage increases
Solution Approach 1:
The patent applies segmentation by dividing the counterbalancing mechanism into multiple discrete weight elements distributed throughout the package structure. This segmented approach allows for localized compensation of warpage forces in different regions of the expanded horizontal package, enabling effective warpage control while maintaining high integration density
Solution Approach 2:
The patent addresses warpage control by transitioning from two-dimensional planar compensation to three-dimensional distributed counterbalancing. By positioning counterbalancing weights at multiple vertical levels and horizontal locations within the package, the system achieves comprehensive warpage control in the expanded horizontal configuration
3Adaptability or versatility
If multiple components are included in the semiconductor package, then functional integration is improved, but the complexity of warpage profile increases
Solution Approach 1:
The patent applies local quality by positioning specific counterbalancing weights at precise locations corresponding to the warpage tendencies of individual components within the multi-component package. Each weight is tailored to address the local thermal expansion characteristics of nearby components, enabling effective warpage control in complex functionally-integrated packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of magnets effectively reduces or suppresses warpage, maintaining a flat package body during high-temperature processes and preventing electrical connection defects, thereby enhancing the reliability of semiconductor packages.
Implementation Method 1
at least one magnet in the package body, the at least one magnet arranged to correspond to a warpage profile of the package body and configured to correct warpage of the package body by applying a force to the package body in response to an external magnetic field applied to the semiconductor package
Data Source
AI summary
A semiconductor package includes a package body including a connection member having a first surface and a second surface opposite the first surface, and at least one semiconductor chip on the first surface of the connection member, a connection terminal on the second surface of the connection member, and connected to the at least one semiconductor chip through the connection member, and at least one magnet in the package body, the at least one magnet arranged to correspond to a warpage profile of the package body and configured to correct warpage of the package body by applying a force to the package body in response to an external magnetic field applied to the semiconductor package.