Semiconductor Package Test Circuit Structure for Warpage Crack Detection
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Solution Overview
Problem
Semiconductor package structures experience warpage and cracking during thermal processes due to low rigidity, leading to potential open circuits and reduced yield.
Innovation Solution
A package structure with a wiring structure that includes at least one dielectric layer, a conductive circuit layer, and a test circuit structure adjacent to the interconnection portion of the conductive circuit layer, allowing for testing of the package structure by simulating the condition of the conductive circuit layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the semiconductor package structure integrates more electronic components to improve electrical performance and functions, then the functionality and electrical performance are improved, but the warpage and cracking risk increase due to low rigidity
Solution Approach 1:
The patent applies preliminary action by incorporating a test circuit structure during the manufacturing process that can proactively detect potential cracks before they affect the main conductive circuit layer. This allows for early detection and prevention of reliability issues while maintaining the ability to integrate multiple electronic components for improved functionality.
2Stability of the object's composition
If the rigidity of the semiconductor package structure is increased to prevent warpage and cracking, then the structural stability is improved, but the flexibility and integration capability may be reduced
Solution Approach 1:
The patent applies segmentation by separating the test function from the main conductive circuit layer. The test circuit structure is disposed adjacent to but distinct from the interconnection portion of the conductive circuit layer, allowing independent testing without affecting the main circuit's integration capability or structural flexibility.
Solution Approach 2:
The test circuit structure acts as an intermediary element that provides crack detection capability without directly interfering with the main conductive circuit layer's function or the package structure's overall flexibility. This intermediary structure enables reliability testing while maintaining integration capability.
3Measurement precision
If a test circuit structure is added adjacent to the conductive circuit layer to enable testing, then the detection capability is improved, but the device complexity increases
Solution Approach 1:
The patent applies copying by creating a test circuit structure that mirrors or simulates the configuration of the main conductive circuit layer. This test circuit is disposed adjacent to the interconnection portion and can be configured to replicate the same routing pattern, allowing accurate crack detection without requiring complex testing equipment or procedures.
Data Source
AI summary
A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.