Semiconductor Package Sub-Panel Sawing for Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in structural stability and warpage control, particularly in wafer-level packaging processes like FOWLP and FOPLP, which require improved methods to reduce costs and enhance performance.
Innovation Solution
A method involving the use of a carrier with specific region configurations and dummy dies to enhance structural stability and warpage control, including sawing steps to separate dies into individual packages, with dummy dies surrounding active dies to improve rigidity and handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a carrier is used to dispose multiple dies during wafer-level packaging, then manufacturing cost is reduced and productivity is improved, but structural stability deteriorates and warpage control becomes difficult
Solution Approach 1:
The carrier is divided into multiple sub-panels through first sawing, with each sub-panel containing one or more dies. This segmentation allows the carrier to maintain structural integrity during processing while enabling individual die extraction and packaging, thus resolving the contradiction between maintaining structural stability and achieving high productivity through wafer-level processing.
Solution Approach 2:
The patent introduces a specific region configuration on the carrier with different horizontal distances from the side of the carrier to the first region containing dies. This local variation in geometry provides enhanced structural support in critical areas while maintaining the overall efficiency of the wafer-level packaging process, thereby improving structural stability without sacrificing productivity.
2Area of stationary object
If dies are disposed closely on the carrier to increase density, then area utilization is improved, but warpage control capability deteriorates
Solution Approach 1:
The patent employs asymmetric positioning of dies on the carrier, with different horizontal distances from the carrier side to the first region containing dies. This asymmetric arrangement optimizes area utilization while distributing thermal and mechanical stresses more evenly across the carrier, thereby maintaining warpage control capability despite high die density.
3Ease of operation
If the carrier is separated into sub-panels by first sawing, then ease of operation is improved for individual die handling, but device complexity increases
Solution Approach 1:
The carrier is pre-divided into sub-panels through first sawing before individual die extraction and testing. This preliminary segmentation simplifies subsequent handling operations by creating self-contained units, each containing one or more dies with their associated support structures, thereby improving ease of operation while managing process complexity through systematic preprocessing.
Data Source
AI summary
A technical idea of a present invention provides a method for manufacturing a semiconductor package, comprising: a step of disposing a plurality of dies on a carrier while being spaced apart from each other in a horizontal direction; a first sawing step of sawing the carrier to separate the carrier into a plurality of sub-panels on which the plurality of dies are disposed; a step of testing the dies; and a second sawing step of sawing between each of the dies of the sub-panels to separate the sub-panels into individual semiconductor packages; wherein the carrier includes a plurality of first regions in which the dies are disposed and a second region in which the dies are not disposed, and wherein a first horizontal distance from a side of the carrier to the first region is smaller than a second horizontal distance from the first region to the first region.