Semiconductor Package Warpage Control via Segmented Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing number of input/output connections in semiconductor chips leads to larger circuit layers and substrates, resulting in increased thickness and warpage, which negatively affects the yield of semiconductor packages.
Innovation Solution
A package structure comprising a first and second lower element, a reinforcement structure, and an encapsulant, where the reinforcement structure surrounds the lower elements and the encapsulant covers them, exposing electrical connectors, thereby improving warpage resistance and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of I/O connections is increased to achieve improved electrical performance and additional functions, then the functionality of semiconductor chips is improved, but the circuit layers increase in size leading to increased thickness and warpage
Solution Approach 1:
The patent divides the semiconductor substrate into multiple smaller substrates, each with fewer I/O connections. This segmentation reduces the size of individual circuit layers, thereby decreasing thickness and warpage while maintaining the overall functionality through the combination of multiple substrates
Solution Approach 2:
The patent transitions from a single-plane substrate to a three-dimensional stacked structure where multiple substrates are arranged vertically. This dimensional change allows I/O connections to be distributed across multiple layers, reducing the I/O density on each individual substrate and consequently reducing warpage
2Reliability
If the circuit layers increase in size to accommodate more I/O connections, then the electrical performance is improved, but the thickness of semiconductor substrate increases
Solution Approach 1:
The patent segments the large circuit layer into multiple smaller circuit layers on separate substrates. Each substrate has reduced circuit layer size and thickness, while the stack of multiple substrates collectively provides the required electrical performance through distributed I/O connections
3Quantity of substance
If the semiconductor substrate size increases to provide more I/O connections, then the number of connections is increased, but the yield of semiconductor substrate decreases
Solution Approach 1:
The patent divides one large substrate into multiple smaller substrates. Each smaller substrate has a higher yield due to reduced size and fewer defects, while the collective stack of multiple substrates provides the total required number of I/O connections, thus improving overall productivity
Solution Approach 2:
The patent allows for the recovery and reuse of the carrier substrate after separating the multiple semiconductor substrates. The carrier can be reused for manufacturing additional substrates, improving overall production efficiency and yield
Data Source
AI summary
A package structure includes a plurality of lower elements, a reinforcement structure and an encapsulant. The lower elements are disposed side by side. The reinforcement structure surrounds the lower elements. The encapsulant covers the lower elements and the reinforcement structure. The electrical connectors of the lower elements are exposed from the encapsulant.