Semiconductor Package Warpage Reduction via Substrate Resin Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor devices face warpage issues due to differences in temperature strains between silicon substrates and epoxy resin molds, leading to potential package failures during the manufacturing process.
Innovation Solution
A semiconductor device design featuring a substrate with a recess having inclined surfaces and an intermediate surface, where the substrate is made of electrical insulative synthetic resin with a filler like SiO2, and the sealing resin matches the substrate material, ensuring uniform thermal expansion and minimizing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon substrate with a recess is used and heated for curing the resin mold, then the semiconductor element can be properly mounted and sealed, but temperature strain occurs due to different thermal expansion coefficients, causing warpage and potential package failure
Solution Approach 1:
The patent changes the material parameter of the substrate from silicon to electrical insulative synthetic resin, which has a thermal expansion coefficient closer to that of the sealing resin. This parameter change resolves the thermal expansion mismatch issue, allowing the substrate and sealing resin to expand and contract uniformly during heating and cooling processes, thereby preventing warpage while maintaining package integrity
Solution Approach 2:
The patent uses a composite material structure where the substrate is made of electrical insulative synthetic resin that can be integrated with the sealing resin material. This composite approach allows both materials to have compatible thermal properties, eliminating the warpage problem caused by heterogeneous material expansion differences while providing both structural support and sealing functions
2Adaptability or versatility
If the thermal expansion coefficients of substrate and sealing resin are different, then each material can be optimized for its specific function, but warpage occurs during heating and cooling processes
Solution Approach 1:
The patent applies homogeneity by selecting the substrate material (electrical insulative synthetic resin) to have similar thermal expansion characteristics to the sealing resin. This material homogeneity ensures that both components respond uniformly to temperature changes, preventing differential expansion and contraction that would cause warpage, while still allowing optimization for各自的 specific functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves substantial reduction in warpage by aligning the thermal expansion coefficients of the substrate and sealing resin, ensuring uniform thermal expansion and preventing package distortions during heating and cooling processes.
Implementation Method 1
the thermal expansion coefficient of the epoxy resin constituting the resin mold is higher than the thermal expansion coefficient of Si constituting the Si substrate, such that the temperature strain occurring on the resin mold is larger than the temperature strain occurring at the Si substrate
Data Source
AI summary
The present disclosure provides a semiconductor device and a method of making the same for suppressing warpages of an article due to a difference of temperature strains during the process of making the semiconductor device. The semiconductor device of the present disclosure includes a substrate having a main surface and a recess recessed therefrom; a semiconductor element disposed in the recess; a wiring portion connected to the substrate and electrically connected to the semiconductor element; and a sealing resin filled in the recess. The substrate includes an electrical insulative synthetic resin. The recess has a bottom surface and a connecting surface connected to the bottom surface and the main surface. The connecting surface includes a first inclined surface connected to the bottom surface; a second inclined surface connected to the main surface; and an intermediate surface connected to the first inclined surface and the second inclined surface.