Semiconductor Package Waveguide Coupling for Laser Die Mounting
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Solution Overview
Problem
Existing technologies face challenges in efficiently mounting a chip equipped with a laser die on a substrate for optical data transmission, which affects the reliability and performance of optical signal transmission systems.
Innovation Solution
The method involves forming a semiconductor package with a carrier having a de-bonding layer, where conductive posts are used to separate regions for electrical and photonic integrated circuits. The package includes a redistribution layer structure, encapsulant, and a waveguide for optical coupling, allowing for efficient integration and connection of optical and electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting methods are used for laser die chips, then the mounting process is simple, but the reliability and performance of optical signal transmission are insufficient
Solution Approach 1:
The patent divides the mounting structure into distinct functional regions using conductive posts that separate the electrical integrated circuit region from the photonic integrated circuit region. This segmentation allows each region to be optimized independently for its specific function while maintaining overall structural integrity and reliability.
Solution Approach 2:
The patent introduces a waveguide as an intermediary component that optically couples the photonic integrated circuit to external optical fibers or other optical components. This intermediary enables efficient optical signal transmission while isolating the laser die from direct mechanical connection requirements, thereby improving reliability.
2Adaptability or versatility
If regions for electrical and photonic integrated circuits are separated, then optical and electrical components can be efficiently integrated, but the device structure becomes more complex
Solution Approach 1:
The substrate is divided into distinct functional regions using conductive posts, creating separate zones for electrical integrated circuits and photonic integrated circuits. This segmentation enables efficient integration by allowing each region to be designed and optimized for its specific component type while maintaining a unified package structure.
Solution Approach 2:
The conductive posts serve multiple functions: they act as electrical interconnects, provide mechanical support, define region boundaries, and facilitate thermal management. This multi-functionality reduces the need for additional specialized components, thereby managing complexity while achieving versatile integration.
3Reliability
If a waveguide is used for optical coupling, then optical signal transmission performance is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The waveguide is pre-formed and positioned within the package structure before final assembly. This preliminary action allows the waveguide to be precisely aligned with the photonic integrated circuit and optical fibers, ensuring optimal optical coupling performance while simplifying the overall manufacturing process by separating alignment-critical steps from general assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient integration of optical and electrical components, enhancing the reliability and performance of optical data transmission systems by providing a robust and secure mounting solution for laser-based chips.
Implementation Method 1
a waveguide for optical coupling, allowing for efficient integration and connection of optical and electrical components
Data Source
AI summary
A semiconductor package includes a first integrated circuit and a first waveguide. The first integrated circuit includes an optical coupler. The first waveguide is optically coupled to the optical coupler. In some embodiments, the first waveguide protrudes beyond the optical coupler. In some embodiments, the first waveguide is partially overlapped with the optical coupler.