Semiconductor Package Wavelength-Selective Transparency for Inspection
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Solution Overview
Problem
Existing semiconductor devices with transparent packages struggle to distinguish marks and detect internal foreign matters post-sealing due to overlapping visible light transparency, making it difficult to read marks and detect surface damages during appearance inspections.
Innovation Solution
A semiconductor device with a package that includes a transparent section opaque to visible light but transparent to near-infrared or near-ultraviolet light, allowing for external observation of the internal components using these wavelengths, while maintaining visibility of the package's appearance under visible light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a transparent package is used to observe internal components, then internal foreign matter can be detected, but marks on the package become difficult to read and surface damages are hard to detect
Solution Approach 1:
The package material's optical properties are changed by selecting a wavelength range (near-infrared or near-ultraviolet) where the package is transparent, while remaining opaque at visible wavelengths. This parameter change in light wavelength enables simultaneous achievement of internal observation and mark readability.
Solution Approach 2:
The package exhibits different transparency properties for different wavelengths of light - opaque to visible light for mark readability, but transparent to near-infrared or near-ultraviolet light for internal observation. This local quality differentiation resolves the contradiction between mark visibility and internal component detectability.
2Loss of information
If a transparent package is used to observe internal components, then internal structure visibility is improved, but package appearance recognition becomes difficult
Solution Approach 1:
The optical transparency parameter of the package is changed by wavelength selection - the package is designed to be opaque in the visible range for appearance recognition, while being transparent in the near-infrared or near-ultraviolet range for internal structure observation.
Solution Approach 2:
The package material exhibits wavelength-dependent optical properties, being opaque to visible light for appearance recognition but transparent to specific non-visible wavelengths for internal observation, resolving the contradiction between appearance visibility and internal structure visibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy recognition of the package's appearance and internal inspection for foreign matters, misalignment, and chip integrity without heating, reducing energy consumption and inspection time.
Implementation Method 1
the package includes a transparent section which is opaque to visible light and transparent to near-infrared light or near-ultraviolet light
Data Source
AI summary
A semiconductor device includes: a semiconductor chip including an electronic part; and a package sealing the semiconductor chip, wherein the package includes a transparent section which is opaque to visible light and transparent to near-infrared light or near-ultraviolet light, and the transparent section is disposed in such a way that the electronic part is observed from outside under the near-infrared light or the near-ultraviolet light.