Semiconductor Package EMI Shielding via Exposed Wire Ball End
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Solution Overview
Problem
Conventional semiconductor packages face challenges with reduced connection strength and reliability between the EMI shielding layer and conductive wires due to frame misalignment and size reduction, which can lead to performance degradation and device damage from electromagnetic interference.
Innovation Solution
Enhance the connection area between the EMI shielding layer and conductive wires by designing the ball end of the conductive wire with a larger outer diameter than the wire body, allowing for a larger exposed surface to which the EMI shielding layer can be connected, thereby improving the connection strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the frame size is reduced to match the smaller carrier, then the semiconductor package size is reduced, but the connection strength and reliability between the frame and carrier deteriorate
Solution Approach 1:
The invention transitions the EMI shielding connection from a planar frame-carrier interface to a three-dimensional structure using the wire's height dimension. The ball end extends vertically from the substrate surface, creating a tall connection point that allows the EMI shielding layer to wrap around and connect to the ball end, effectively utilizing the vertical dimension to increase connection area despite reduced horizontal frame size
Solution Approach 2:
The invention changes the geometric parameters of the conductive wire by forming a ball end with larger diameter than the wire body. This parameter change creates a larger surface area for EMI shielding connection while maintaining the overall wire function, directly addressing the reliability issue without increasing package footprint
2Volume of moving object
If the frame size is reduced, then the semiconductor package size is reduced, but the alignment difficulty between the frame and carrier increases
Solution Approach 1:
The invention applies local quality by concentrating the connection function at the ball end location rather than distributing it across the entire frame surface. The ball end serves as a localized, precisely-positioned connection point that is easier to align with the EMI shielding layer than a distributed frame structure, improving manufacturing precision
Solution Approach 2:
By extending the connection point vertically through the ball end, the invention creates a taller target for alignment in the vertical dimension, making it less sensitive to horizontal misalignment errors during manufacturing, thus improving overall alignment precision
3Reliability
If the connection area between EMI shielding layer and conductive wire is increased, then the connection strength and reliability are enhanced, but the device complexity increases
Solution Approach 1:
The invention merges the EMI shielding layer with the ball end of the conductive wire by forming them as an integrated structure. The EMI shielding layer is deposited to cover the molding material and connect to the ball end, combining two functional elements into a unified assembly that enhances connection strength without requiring separate complex mounting mechanisms
Solution Approach 2:
The ball end's enlarged geometry automatically provides a larger surface area for EMI shielding connection without requiring additional components or complex assembly steps. The wire structure itself serves the dual purpose of electrical conduction and EMI shielding attachment, simplifying the overall device structure while improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased connection area between the EMI shielding layer and conductive wires results in enhanced reliability and reduced misalignment issues, effectively mitigating electromagnetic interference effects.
Implementation Method 1
The conductive wire is formed on the substrate by a wire bonding process
Implementation Method 2
The molding material is provided on the substrate to cover the semiconductor component, the wire body and the conduction end
Implementation Method 3
an EMI shielding layer... connected to the ball end
Data Source
AI summary
In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.