Semiconductor Package Module Structure for Stable Wire Bonding
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Solution Overview
Problem
Conventional semiconductor packages face reliability issues due to the bonding of conductive wires to thin lead frames, leading to unstable connections and increased complexity in wire bonding.
Innovation Solution
The semiconductor package design includes a package module with a first substrate, electronic elements, conductive wires, and a package body, which provides a stable platform for wire bonding, reducing the complexity and increasing the reliability of the connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conductive wires are bonded to thin lead frames, then the structure is simple, but the bonding reliability is poor
Solution Approach 1:
The patent introduces a carrier as an intermediary component between the thin lead frame and the conductive wires. The carrier provides a thicker, more stable bonding surface that replaces the thin lead frame for wire bonding purposes, thereby improving bonding reliability without significantly increasing overall structural complexity
Solution Approach 2:
The patent adds a vertical dimension to the bonding structure by stacking multiple layers (carrier, lead frame, electronic element) to create a thicker bonding platform. This dimensional change transforms the thin 2D lead frame surface into a substantial 3D bonding structure, enhancing mechanical stability and bonding reliability
2Ease of manufacture
If conventional lead frame structure is used, then manufacturing is simple, but wire bonding complexity increases
Solution Approach 1:
The carrier serves as a mediator that simplifies wire bonding by providing a dedicated bonding surface. The carrier's structure is designed specifically for wire bonding, separating this function from the lead frame's manufacturing process, thereby reducing wire bonding complexity while maintaining manufacturing simplicity
3Quantity of substance
If thin lead frame is used for bonding, then material usage is reduced, but connection stability decreases
Solution Approach 1:
The patent achieves better connection stability without proportionally increasing material usage by utilizing vertical stacking. The carrier adds thickness in the vertical dimension rather than expanding horizontally, providing enhanced mechanical support and connection stability while maintaining efficient material utilization
Data Source
AI summary
A semiconductor package includes a carrier, a package module and a second package body. The package module is disposed on the carrier and includes a first substrate, a first electronic element, a first conductive wire and a first package body. The first substrate has a first electrical surface facing the carrier and a second electrical surface opposite to the first electrical surface. The first electronic element is disposed on the first electrical surface. The first conductive wire connects the electronic element with the first electrical surface of the first substrate. The first package body encapsulates the first electrical surface, the first electronic element and the first solder wire. The second package body encapsulates the package module and a portion of the carrier.