Semiconductor Package Wire Fixing Film Design
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Solution Overview
Problem
Existing semiconductor package assembly technologies face challenges in maintaining high reliability and preventing wire sweeping, which can lead to short circuits, especially when dealing with miniaturized and high-performance devices that require efficient electrical coupling and protection from external factors.
Innovation Solution
A semiconductor package design featuring a substrate with a structural body, a semiconductor chip having an overhang portion with bonding pads, and a wire fixing film with a high-hardness support layer, adhesive layer, and fixing layer to securely fix wires electrically coupling the chip to the substrate, preventing wire bending and contact with adjacent wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically couple semiconductor chip and substrate, then electrical connection is achieved, but wire sweeping may occur causing short circuits and reliability issues
Solution Approach 1:
A wire fixing film is introduced as an intermediary component between the wire and the substrate. This film includes a support layer, adhesive layer, and fixing layer that work together to secure the wire in place, preventing wire sweeping while maintaining electrical connection reliability
Solution Approach 2:
The wire fixing film is prepared and positioned in advance before wire bonding. The support layer is formed with a pattern corresponding to the wire layout, and the adhesive layer is pre-applied to the substrate, enabling the wire to be fixed in the correct position before bonding occurs, thus preventing sweeping
2Volume of moving object
If miniaturization is pursued in semiconductor devices, then device size is reduced, but wire management becomes more difficult increasing short circuit risk
Solution Approach 1:
The wire fixing film provides localized support and fixation at specific positions where wires need to be secured. The support layer is formed with a pattern that corresponds to the wire layout, providing targeted support only where needed, which is particularly effective in miniaturized devices with dense wire routing
Solution Approach 2:
The wire fixing film is constructed as a composite structure with multiple layers: a support layer for mechanical strength and positioning, an adhesive layer for bonding to the substrate, and a fixing layer for securing the wire. This composite structure addresses the complex wire management requirements in miniaturized devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances electrical reliability by preventing wire sweeping and potential short circuits, ensuring stable and reliable electrical connections even in miniaturized and high-performance semiconductor devices.
Implementation Method 1
a wire fixing film attached onto the structural body
Implementation Method 2
wires electrically coupling the bonding pads to the substrate
Data Source
AI summary
A semiconductor package may include a substrate, and a structural body disposed over the substrate. The semiconductor package may include a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging out over the side surface of the structural body. The semiconductor package may include one or more bonding pads disposed on the overhang portion, and one or more wires electrically coupling the bonding pads to the substrate. The semiconductor package may include a wire fixing film attached onto the structural body, and overhanging out over the side surface of the structural body to fix the one or more wires.