Semiconductor Package Wire Reinforcement for POP Reliability
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Solution Overview
Problem
Current semiconductor packages face challenges in reliability and durability due to limitations in connecting substrates and maintaining wire integrity, which affects electrical connections and thermal radiation properties.
Innovation Solution
A semiconductor package design featuring a first substrate with a semiconductor chip, a second substrate spaced apart, bonding wires connecting them, and an under-fill pattern and mold structure to reinforce the connection and improve stiffness, allowing for a package-on-package structure with enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to connect substrates, then electrical connection is achieved, but wire integrity and structural stability deteriorate
Solution Approach 1:
The patent applies composite materials by combining bonding wires with under-fill patterns and mold structures. The under-fill pattern (400) is formed around the bonding wires (300), and the mold structure (950) encapsulates both, creating a composite system where the wire provides electrical connection while the under-fill and mold provide structural support and stability, resolving the contradiction between electrical functionality and structural strength.
Solution Approach 2:
The patent implements beforehand cushioning by forming the under-fill pattern (400) around the bonding wires (300) before final packaging. This under-fill layer acts as a protective cushion that reinforces the wires against mechanical stress and environmental factors, preventing wire damage and maintaining integrity throughout the package lifecycle.
2Productivity
If substrates are spaced apart for package-on-package structure, then integration density is improved, but alignment precision and connection reliability worsen
Solution Approach 1:
The patent uses the mold structure (950) as an intermediary element that connects and aligns the first substrate (1000) and second substrate (2000). The mold structure encapsulates the spaced substrates and provides a rigid framework that maintains precise relative positioning, enabling package-on-package integration while ensuring manufacturing precision through its structural support and alignment features.
3Stability of the object's composition
If wire connections are reinforced with under-fill patterns, then structural integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functions into the under-fill pattern (400) formation process. The same under-fill material that reinforces wire connections also serves as part of the encapsulation system and provides structural support for the mold structure (950). This consolidation of functions reduces the need for separate reinforcement components and simplifies the overall manufacturing process while maintaining wire connection stability.
Data Source
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AI summary
A semiconductor package includes a first substrate, a semiconductor chip on the first substrate, a second substrate spaced apart from the first substrate , a wire spaced apart from a lateral surface of the semiconductor chip and connecting the first substrate to the second substrate, a mold structure on a top surface of the semiconductor chip, the lateral surface of the semiconductor chip, and a lateral surface of the wire, and an under-fill pattern on the lateral surface of the wire and is between the wire and the mold structure.