Semiconductor Packaging Structure Antenna Module Warpage Control
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges with warpage issues and poor heat conductivity, leading to overheating and manufacturing difficulties, especially in fan-out wafer level packaging, which affects the integration and performance of radio frequency chips.
Innovation Solution
A semiconductor packaging structure featuring a substrate with a redistribution layer, metal bump, semiconductor chip, and an antenna module, where the substrate is made of quartz or sapphire for reduced warpage and improved heat conductivity, and an underfill layer is used to enhance adhesion and stability, with the antenna module arranged in a hexagonal honeycomb pattern on the substrate's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plastic packaging is used for fan-out wafer level packaging, then miniaturization and low cost are achieved, but warpage control becomes difficult and heat conductivity deteriorates
Solution Approach 1:
The patent changes the substrate material from plastic to quartz glass or sapphire, fundamentally altering the physical parameters of the packaging structure. This material substitution resolves the warpage control issue while maintaining miniaturization benefits, as quartz glass and sapphire provide dimensional stability at nanometer scales.
Solution Approach 2:
The patent employs composite material structures by combining quartz glass/sapphire substrates with metal bumps, redistribution layers, and underfill materials. This composite approach achieves both the low-cost miniaturization of FOWLP and the warpage control of rigid substrates, creating a hybrid packaging solution.
2Ease of manufacture
If plastic packaging is used for fan-out wafer level packaging, then miniaturization and low cost are achieved, but heat conductivity deteriorates causing overheating
Solution Approach 1:
The patent fundamentally changes the thermal parameter of the packaging by substituting plastic with quartz glass or sapphire substrates. These materials possess superior thermal conductivity compared to plastic, enabling effective heat dissipation from high-frequency transistors while maintaining the miniaturized FOWLP form factor.
Solution Approach 2:
The patent introduces metal bumps and redistribution layers as intermediary thermal pathways between the semiconductor chip and the quartz glass/sapphire substrate. These metallic intermediaries enhance heat transfer efficiency, bridging the gap between the chip's heat generation and the substrate's heat dissipation capabilities.
3Adaptability or versatility
If antennas are laid out directly on PCB during layout design, then radio frequency function is achieved, but PCB area increases
Solution Approach 1:
The patent merges the antenna function with the semiconductor packaging structure itself by integrating antennas into the quartz glass or sapphire substrate. This consolidation eliminates the need for separate PCB antenna areas, as the packaging substrate serves dual purposes: mechanical support and RF radiation.
Solution Approach 2:
The patent makes the packaging substrate multi-functional by enabling it to serve both as the mechanical support structure for the semiconductor chip and as the antenna radiating element. This universal design allows the same substrate to fulfill multiple functions, reducing overall system area while maintaining RF performance.
4Productivity
If transistors are developed towards higher density and higher clock frequency, then function and performance are improved, but heat generation increases causing overheating
Solution Approach 1:
The patent introduces metal bumps and redistribution layers as intermediary thermal pathways between the high-density transistor chip and the quartz glass/sapphire substrate. These metallic intermediaries conduct heat away from the heat-generating transistors, preventing overheating while allowing continued increases in transistor density and clock frequency.
Solution Approach 2:
The patent changes the thermal parameter of the packaging system by using quartz glass or sapphire substrates with superior thermal conductivity. This parameter change enables the system to handle the increased heat generation from high-density, high-frequency transistors without overheating, supporting continued performance improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses warpage and heat conductivity issues, enhancing packaging reliability and efficiency while allowing for miniaturization and high integration, suitable for mass production with improved yield and reduced costs.
Implementation Method 1
an underfill layer is used to enhance adhesion and stability
Implementation Method 2
the substrate is made of quartz or sapphire for reduced warpage and improved heat conductivity
Data Source
AI summary
The present disclosure provides a semiconductor packaging structure having an antenna module, comprising: a substrate having a first surface and a second surface opposite to the first surface; a redistribution layer located on the first surface of the substrate; a metal bump located on one side, insulated from the substrate, of the redistribution layer, and electrically connected with the redistribution layer; a semiconductor chip disposed on a surface, insulated from the substrate, of the redistribution layer, and electrically connected with the redistribution layer, a space is configured between the semiconductor chip and the metal bump; and an antenna module located on the second surface of the substrate.