Semiconductor Packaging Device With Copper Base And Distributed Electrodes
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Solution Overview
Problem
Conventional semiconductor laser packaging devices suffer from poor heat dissipation and high resistance due to the use of nickel-iron alloy substrates and colloidal silver, limiting the power operation to below the watt-level and causing overheating, as well as obstructing light emission with metal wires traversing over the chip.
Innovation Solution
A packaging device with a highly conductive metal base of copper or aluminum, using conductive adhesive like solder paste for better heat conduction, and a wire bonding structure with isolated electrode areas to allow more efficient heat dissipation and reduced resistance, allowing for higher power operation without blocking light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If nickel-iron alloy substrate and colloidal silver are used for bonding, then the packaging device can be manufactured with conventional materials, but heat dissipation capability is poor causing overheating
Solution Approach 1:
The patent changes the material parameters of the substrate from nickel-iron alloy to copper or aluminum, which have superior thermal conductivity. This parameter change directly addresses the heat dissipation issue while maintaining manufacturability through standard bonding processes.
Solution Approach 2:
The patent employs composite material structures including copper or aluminum substrates combined with conductive adhesives or solder paste, creating a multi-layer composite system that optimizes both thermal management and electrical connectivity properties.
2Reliability
If multiple metal wires are used to connect all laser elements to a single electrode stem, then electrical connection is achieved, but resistance increases and heat dissipation deteriorates
Solution Approach 1:
The patent segments the single electrode stem connection into multiple distributed electrode areas on the substrate. This segmentation reduces the current load on individual wire bonds, lowering resistance and heat generation while maintaining reliable electrical connections to all laser elements.
Solution Approach 2:
The patent transitions from a one-dimensional single stem connection to a two-dimensional distributed electrode array on the substrate plane. This dimensional change allows multiple wire bonds to be spatially distributed, reducing interference and improving thermal management.
3Reliability
If metal wires traverse over the semiconductor laser chip for connection, then electrical connectivity is established, but light emission is blocked by the wires
Solution Approach 1:
The patent extracts the wire bonds from the optical path by routing them along the substrate edges and connecting to distributed electrode areas away from the laser element array. This extraction eliminates light blocking while preserving electrical connectivity.
4Power
If conventional TO-Can packaging is used with nickel-iron alloy substrate, then manufacturing simplicity is maintained, but power operation cannot be upgraded to watt-level due to overheating
Solution Approach 1:
The patent changes the thermal conductivity parameter of the substrate material from nickel-iron alloy to copper or aluminum, enabling watt-level power operation by effectively managing heat dissipation while maintaining a relatively simple packaging structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables superior heat dissipation, reduced resistance, and flexible layout design, supporting high power operation of semiconductor light-emitting elements with improved heat management and reduced heat production.
Implementation Method 1
Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two
Implementation Method 2
The metal base is of highly heat conductive copper or aluminum... achieves superior heat conduction and dissipation effects
Data Source
AI summary
A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.