Semiconductor Packaging with Integrated Heatsink and Liquid Crystal Polymer
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Solution Overview
Problem
The cost and complexity of packaging semiconductor chips are increased due to the need for designs that protect the chips from environmental and physical stresses while allowing for heat dissipation and electrical signal transmission.
Innovation Solution
A semiconductor package is manufactured using a method that involves forming heatsinks and leadframes with liquid crystal polymer, which are coupled and cured to create a unitary packaging structure that can be singulated into individual substrates, allowing for efficient heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging designs are used to protect semiconductor chips, then protection from environmental and physical stresses is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated substrate structure. The substrate integrates leadframes for electrical connectivity, heatsinks for thermal management, and protective encapsulation into one unified component, eliminating the need for separate packaging elements and reducing overall complexity while maintaining protection.
Solution Approach 2:
The packaging substrate serves multiple functions simultaneously: it provides mechanical support and protection, establishes electrical connections through integrated leadframes, dissipates heat through built-in heatsink structures, and enables thermal coupling to heat-generating components. This multi-functionality reduces the number of separate components needed.
2Temperature
If packaging designs include heat dissipation structures, then heat removal is improved, but manufacturing cost increases
Solution Approach 1:
The heatsink structure is integrated directly into the packaging substrate rather than being a separate component. This merging of thermal management functionality into the base substrate reduces part count, simplifies assembly, and lowers manufacturing costs while maintaining effective heat dissipation capability.
Solution Approach 2:
The substrate utilizes composite material structures that provide both mechanical support and thermal conduction pathways. The integration of thermally conductive materials into the substrate architecture enables efficient heat transfer from the semiconductor device to external heat sinks without requiring additional expensive thermal management components.
3Reliability
If packaging designs include electrical signal transmission paths, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The leadframes are integrated directly into the substrate structure, combining electrical connection functionality with the mechanical support structure. This integration eliminates separate wiring steps and simplifies the overall packaging design while ensuring reliable electrical signal transmission between the semiconductor device and external circuits.
4Productivity
If batch processing methods are used for manufacturing, then productivity is improved, but manufacturing precision may decrease
Solution Approach 1:
The manufacturing process is designed to produce arrays of identical packaging substrates in batch, with each substrate being a standardized, segmented unit. This segmentation allows for consistent, repeatable manufacturing of multiple units simultaneously while maintaining uniform quality through standardized design and process parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and complexity by enabling cost-effective, high-quality packaging with efficient heat removal from semiconductor devices, improving the assembly process and repeatability.
Implementation Method 1
The leadframe on which the liquid crystal polymer is dispensed is mounted to a heatsink. The liquid crystal polymer is cured to form a unitary packaging structure.
Data Source
AI summary
A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.