Semiconductor Packaging Eliminates Insert Case to Reduce Cost
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Solution Overview
Problem
Conventional semiconductor devices have a high manufacturing cost due to the expensive insert case, which hinders cost reduction efforts.
Innovation Solution
A semiconductor device design that eliminates the need for an insert case by using an element-mounting member, a semiconductor chip, a connecting terminal, and sealing resin, where the element-mounting member and semiconductor chip are covered with sealing resin, and the connecting terminal is protruded, reducing the need for an insert case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an insert case is used to surround the ceramic substrate and support the semiconductor device, then the structural integrity and support are improved, but the manufacturing cost increases
Solution Approach 1:
The patent removes the insert case from the semiconductor device structure entirely. The ceramic substrate is mounted directly on the heat-radiating plate without being surrounded by an insert case, eliminating this cost component while maintaining structural functionality through alternative support mechanisms
Solution Approach 2:
The patent merges the functions of the insert case into other components. The terminal base and heat-radiating plate assume structural support roles previously handled by the insert case, combining multiple functions into fewer components to reduce overall cost
2Stability of the object's composition
If an insert case is used to support the terminal base and provide structural framework, then the device stability is improved, but the manufacturing complexity increases
Solution Approach 1:
The insert case is extracted from the device structure, simplifying the assembly process. The terminal base is mounted directly on the heat-radiating plate, reducing the number of assembly steps and components without compromising device stability
Solution Approach 2:
The heat-radiating plate serves multiple functions: it provides thermal management, structural support for the ceramic substrate, and a mounting surface for the terminal base. This multi-functionality eliminates the need for separate support structures, reducing manufacturing complexity
Data Source
AI summary
A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and corresponding lead terminal and the like are electrically connected by a prescribed wire. Next, the lead frame is set in a metal mold such that the semiconductor chip is covered with resin from above the semiconductor chip. Thermoplastic resin is introduced into the metal mold, and semiconductor chip and the like are sealed. By taking out the resulting body from the metal mold, a semiconductor is formed. Thus, a semiconductor device can be provided with reduced manufacturing cost.