Semiconductor Packaging EMI Shielding via Lateral Metal Layer
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Solution Overview
Problem
The miniaturization of electronic devices is limited by electromagnetic interference (EMI) issues, as conventional electromagnetic shielding methods require additional space and connections, hindering the integration of semiconductor devices into smaller form factors.
Innovation Solution
A semiconductor device design featuring a substrate with ground pads and a metal layer that extends to lateral surfaces, forming a shielding layer without covering the ground pads, which directly connects to the semiconductor chip and shields EMI, eliminating the need for external shielding components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional electromagnetic shielding is disposed around the semiconductor device and connected to the circuit board, then EMI shielding effectiveness is improved, but device size and complexity increase
Solution Approach 1:
The patent merges the electromagnetic shielding function with the existing substrate structure by forming a metal layer that extends from the ground pad across the substrate surface and down the lateral surfaces. This integration eliminates the need for separate external shielding components and their associated connections to the circuit board, thereby reducing structural complexity while maintaining EMI shielding effectiveness.
2Object-affected harmful factors
If conventional electromagnetic shielding is disposed around the semiconductor device, then EMI shielding effectiveness is improved, but device dimensions increase
Solution Approach 1:
The patent utilizes the vertical dimension by extending the metal layer down the lateral surfaces of the substrate. This three-dimensional configuration provides effective EMI shielding without increasing the horizontal footprint of the device, allowing miniaturization while maintaining shielding performance.
3Object-affected harmful factors
If external electromagnetic shielding components are added, then EMI shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The metal layer is formed in segmented portions: a first portion on the upper surface of the substrate and a second portion extending down the lateral surfaces. This segmentation allows for simplified manufacturing processes where each portion can be formed independently through standard semiconductor fabrication techniques, reducing overall manufacturing complexity compared to assembling external shielding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes EMI emissions, allowing for the miniaturization of electronic devices by integrating shielding within the device structure without increasing size or requiring additional connections, thus enhancing packaging efficiency.
Implementation Method 1
a metal layer covering the first molding member and extending to lateral surfaces of the substrate while contacting the first exposed surface
Data Source
AI summary
A semiconductor device includes a substrate, a semiconductor chip, a first molding member and a metal layer. The substrate includes a first ground pad formed therein, the first ground pad having a first exposed surface exposed at a first surface of the substrate. The semiconductor chip is formed on the first surface of the substrate. The first molding member is formed on the first surface of the substrate and covers the semiconductor chip while not covering the first exposed surface. The metal layer covers the first molding member and extends to lateral surfaces of the substrate while contacting the first exposed surface.