Semiconductor Packaging Panel Segmentation for Yield
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Solution Overview
Problem
The existing methods of fabricating semiconductor packaging structures are complex, result in low yield, waste effective substrate area, and high costs due to the need for large equipment and increased precision errors as substrates become thinner, and the inefficiency of processing one substrate unit at a time.
Innovation Solution
A method that involves cutting a complete panel of up-down paired packaging substrates into blocks with embedded conductive pads and dielectric layers, allowing for simultaneous chip attachment and packaging on multiple units, followed by cutting into individual units, simplifying the process and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the complete panel of packaging substrates is cut into packaging substrate units or strips before chip attachment, then the manufacturing process can be performed on smaller substrates with better precision, but only one unit is processed at a time which reduces productivity and increases cost
Solution Approach 1:
The complete panel is divided into multiple packaging substrate units arranged in an array, allowing the system to process multiple units simultaneously while maintaining the precision benefits of smaller substrate sizes. The panel is segmented into M×N units that can be handled together during chip attachment and packaging processes.
Solution Approach 2:
Multiple packaging substrate units are combined into a single complete panel structure that can be processed together. By merging multiple units into one panel, the system achieves both the precision of small substrates and the productivity of batch processing, as all units undergo chip attachment and packaging simultaneously.
2Productivity
If the complete panel of packaging substrates is not cut into units or strips, then all chips can be packaged at once increasing productivity, but larger equipment is required increasing equipment cost and precision errors increase
Solution Approach 1:
The large complete panel is segmented into multiple smaller packaging substrate units, each maintaining high manufacturing precision while collectively enabling batch processing of multiple chips. The segmentation allows standard precision equipment to process the panel as a whole without requiring oversized equipment.
Solution Approach 2:
Instead of processing one large substrate in a single plane, the system uses a two-dimensional array arrangement of multiple units within the complete panel. This dimensional organization allows simultaneous processing of multiple chips across the panel area, increasing throughput while maintaining precision through the modular unit structure.
3Ease of operation
If packaging substrate strips with frames are used to assist during manufacturing processes, then the substrates can be handled during processing, but the frames occupy too much area wasting material cost
Solution Approach 1:
The complete panel structure serves multiple functions simultaneously: it provides mechanical support for handling, enables precise alignment during manufacturing, and maximizes the usable area for chip attachment. The panel itself acts as the carrier without requiring additional frame structures, eliminating material waste while maintaining ease of operation.
Solution Approach 2:
The unnecessary frame structure is extracted and removed from the design. The complete panel without frames provides sufficient structural integrity and handling capability, eliminating the material waste associated with frames while maintaining ease of operation during manufacturing processes.
Data Source
AI summary
A method fabricates a packaging structure, including cutting a complete panel of packaging substrates with a large area into a plurality of packaging substrate blocks each having a plurality of packaging substrate units; mounting a semiconductor chip on each of the packaging substrate units and securing the semiconductor chip to the packaging substrate unit with a molding material, to form a plurality of packaging structure blocks each having a plurality of packaging structure units; and cutting the packaging structure block into a plurality of packaging structure units. Accordingly, each of the packaging structure unit has a moderate area, the alignment difference between the packaging structure units in each of the packaging structure blocks can be reduced, and the semiconductor chips for all the packaging substrate units in each of the packaging substrate blocks can be packaged at one time. Therefore, the yield is increased and the overall cost is reduced.