Semiconductor Packaging Reference Markers for Interconnect Alignment

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Solution Overview

Problem

The challenge lies in creating precise electrical connections within shrinking semiconductor packages to support increasing circuit density and functionality while maintaining cost-effectiveness and reliability, as existing methods lack accuracy and efficiency in aligning solder balls with ablation positions using fiducial marks.

Innovation Solution

A semiconductor packaging system that includes a base substrate with edges, mounted electrical interconnects, and an encapsulant with reference markers and openings, where the reference markers are positioned based on physical locations of the edges to enhance precision and accuracy during the formation of openings using laser ablation, sonic drilling, or micro-etching processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If package size is reduced to meet market demand for smaller electronic products, then product size decreases, but manufacturing precision requirements increase due to tighter spacing of electrical connections

Engineering Contradiction:

Improvepackage sizeVSAvoidelectrical connection placement precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by forming reference markers on the substrate before mounting electrical interconnects. These markers serve as pre-established alignment references that guide subsequent packaging operations, enabling precise placement of electrical connections even as package size shrinks. The reference markers are positioned at predetermined locations based on edge detections, creating a framework for maintaining manufacturing precision in smaller packages.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If the number of electrical connections is increased to support higher circuit density, then functionality increases, but alignment accuracy requirements become more stringent

Engineering Contradiction:

Improvecircuit density and functionalityVSAvoidball-to-hole alignment accuracy

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent introduces reference markers as intermediary elements that mediate between the substrate edges and the electrical interconnects. These markers act as intermediate reference points that simplify the alignment process, allowing manufacturing equipment to accurately locate and align solder balls with electrical connections by referencing the markers rather than directly using substrate edges. This intermediary system enables high precision alignment even with increased numbers of electrical connections.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If fiducial marks are used for alignment during manufacturing, then positioning is simplified, but accuracy is insufficient for advanced packaging applications

Engineering Contradiction:

Improvealignment process simplicityVSAvoidalignment accuracy

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by modifying the characteristics of reference markers compared to traditional fiducial marks. The reference markers are formed with specific geometric parameters (such as rectangular patterns with defined dimensions) and are positioned at multiple locations including corners and edges of the substrate. These parameter modifications enable the markers to serve dual purposes: they are easy to detect by manufacturing equipment (maintaining ease of operation) while providing significantly improved alignment accuracy (enhancing manufacturing precision) for advanced packaging applications.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the accuracy of electrical interconnect placement and solder joint connectivity, reducing ball-to-hole misalignment and enhancing the overall performance and reliability of semiconductor packaging systems without requiring additional tooling or special equipment.

Implementation Method 1

applying an encapsulant having a reference marker and an opening over the electrical interconnect

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS8497575B2Semiconductor packaging system with an aligned interconnect and method of manufacture thereof

Publication Date: 2013.07.30 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A method of manufacture of a semiconductor packaging system includes: providing a base substrate having edges; mounting an electrical interconnect on the base substrate; and applying an encapsulant having a reference marker and an opening over the electrical interconnect, the reference marker around the electrical interconnect based on physical locations of the edges.