Semiconductor Packaging Electromagnetic Shielding via Patterned Metal Layer
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Solution Overview
Problem
Conventional semiconductor packaging structures lack effective electromagnetic shielding, leading to interference from electromagnetic waves that degrade the sound quality of micro-electromechanical microphones.
Innovation Solution
A semiconductor packaging structure is developed with a patterned passivation layer and a patterned metal layer on the substrate, electrically connected to a grounding pad via wires, providing electromagnetic shielding without relying on conductive housings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional semiconductor packaging structures are used without electromagnetic shielding, then the device complexity is reduced and manufacturing is simpler, but electromagnetic interference degrades the sound quality of micro-electromechanical microphones
Solution Approach 1:
The electromagnetic shielding layer is nested within the packaging structure itself, integrated between the substrate and the housing rather than being a separate external component. This nesting approach provides electromagnetic shielding functionality while maintaining a compact package design without adding external shielding structures.
Solution Approach 2:
The electromagnetic shielding is implemented using a thin conductive film layer deposited on the substrate surface, rather than using bulky conductive housing structures. This thin film approach provides effective electromagnetic shielding while minimizing the impact on package size and structural complexity.
2Object-affected harmful factors
If conductive housing is used for electromagnetic shielding, then electromagnetic interference is reduced, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The electromagnetic shielding function is merged with the substrate structure by depositing a conductive layer directly on the substrate surface during the existing manufacturing process. This integration eliminates the need for separate conductive housing components and their associated assembly steps, simplifying manufacturing while providing effective shielding.
Solution Approach 2:
The mechanical approach of using conductive housing structures for shielding is replaced with a deposition-based approach where a conductive film is applied to the substrate. This substitution eliminates complex mechanical assembly of shielding components and integrates shielding into the semiconductor fabrication process itself.
3Object-affected harmful factors
If a patterned metal layer is added to the substrate for shielding, then electromagnetic shielding effectiveness is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The metal layer is patterned with different properties in different regions: areas requiring electromagnetic shielding have continuous or densely patterned metal, while areas requiring electrical connections have openings or specific patterns. This local differentiation provides targeted shielding where needed while maintaining manufacturing feasibility through standard photolithography techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference, enhancing the sound quality of micro-electromechanical microphones by incorporating a patterned metal layer and wires for shielding within the packaging structure.
Implementation Method 1
the patterned metal layer is electrically connected to at least a grounding pad on the substrate via a wire, thus providing an electromagnetic shielding function for the package
Data Source
AI summary
A semiconductor packaging structure having electromagnetic shielding function is disclosed, in which the packaging structure includes a carrier and a semiconductor substrate disposed thereon. The semiconductor substrate has a patterned passivation layer and a patterned metal layer disposed thereon, in which the patterned metal layer is electrically connected to at least a grounding pad of the carrier via a wire, whereby possessing the semiconductor packaging structure to have electromagnetic shielding function. A method for manufacturing a semiconductor packaging structure having electromagnetic shielding function is also disclosed in the present invention.