Semiconductor Packaging Without Soldering Wire
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Solution Overview
Problem
Conventional semiconductor chip packaging methods are hindered by high costs of soldering equipment and materials, difficulty in controlling temperature and pressure, leading to low yield and production inefficiency, and potential damage to solder pads due to the use of solder wires and high-temperature reflow soldering processes.
Innovation Solution
A semiconductor chip packaging structure and method that eliminates the need for soldering wires by using a conductive circuit formed through engraving or etching of a metal or alloy film, which is then covered with a packaging glue layer cured by electromagnetic waves, on a substrate made of glass, plastic, or ceramic, without requiring solder paste or reflow soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering wire method is used, then electrical connection is achieved, but equipment cost and material cost increase significantly
Solution Approach 1:
The patent extracts and eliminates the soldering wire and solder paste from the packaging process, replacing them with a conductive circuit formed directly on the substrate through engraving or etching a metal film. This removes the need for expensive soldering equipment and solder materials while maintaining electrical connection functionality.
Solution Approach 2:
The patent replaces the mechanical soldering process (which requires specialized equipment) with a deposition and engraving process. The conductive circuit is formed by depositing a metal film and then engraving or etching it to create conductive traces, substituting complex mechanical soldering equipment with simpler deposition and engraving equipment.
2Reliability
If reflow soldering process is used, then soldering is completed, but temperature control difficulty and production time increase
Solution Approach 1:
The patent extracts the reflow soldering process entirely from the packaging method. Instead of heating the substrate to melt solder paste, the conductive circuit is formed at room temperature through deposition and engraving, eliminating the time-consuming reflow process and associated temperature control requirements.
Solution Approach 2:
The conductive circuit is formed in advance during substrate fabrication, before chip mounting. The metal film is deposited and engraved to create the circuit traces, so that when chips are mounted, the electrical connection path already exists, eliminating the need for subsequent soldering operations.
3Reliability
If high temperature soldering is used, then electrical connection is formed, but solder pad damage and yield reduction occur
Solution Approach 1:
The patent converts the potential harm of high-temperature soldering into a benefit by using a room-temperature process. The engraving or etching of the metal film creates the conductive circuit without applying heat, thus protecting the solder pads from thermal damage while still achieving reliable electrical connection.
Solution Approach 2:
The patent replaces the thermal field (heat) used in soldering with a mechanical field (engraving or etching). The conductive circuit is formed by physically removing or shaping the metal film, substituting thermal processing with mechanical processing to avoid heat-induced damage to sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces equipment costs, improves production efficiency, enhances yield and reliability, and reduces environmental impact by eliminating waste and high-temperature processes, while allowing for automation and energy savings through the use of locally available plating technologies and materials.
Implementation Method 1
the metal film or the alloy film is formed by vacuum vapor deposition
Implementation Method 2
the metal film or the alloy film is formed by vacuum vapor deposition, a magnetically-controlled sputtering
Implementation Method 3
the packaging glue layer is cured by electromagnetic wave
Data Source
AI summary
A semiconductor chip packaging structure without soldering wire and a packaging method thereof are disclosed. The semiconductor chip packaging structure comprises at least one packaging structure, and each packaging structure comprises a substrate, and a semiconductor chip is arranged on the substrate. Pins of the semiconductor chip are electrically connected to the conductive circuit formed by engraving or etching metal film or alloy film. The semiconductor chip packaging structure also comprises a packaging glue layer covering the semiconductor chip and the conductive circuit. The semiconductor chip packaging method includes steps of arranging a semiconductor chip on the substrate; forming a metal film or an alloy film around the semiconductor chip; etching the metal film or alloy film, to form the conductive circuit; and covering a packaging glue layer on the semiconductor chip and the conductive circuit. As a result, the production efficiency can be improved greatly.