Semiconductor Packaging Warpage Control via Interlocking Features
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Solution Overview
Problem
Panel warpage in semiconductor device packaging poses challenges during encapsulation, affecting yield, reliability, and costs due to difficulties in forming connections to semiconductor die.
Innovation Solution
Incorporating warpage control features in semiconductor device packaging panels that interlock with a warpage control fixture, applying tension to flatten the panels, allowing for subsequent planar-sensitive processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If panel-level packaging encapsulation is performed, then manufacturing efficiency is improved, but panel warpage occurs affecting connection formation
Solution Approach 1:
The patent applies preliminary action by forming recesses into the encapsulant material before the warpage control process, creating pre-positioned attachment points for the carrier substrate. This preliminary structuring enables subsequent tension application to effectively flatten warped panels during connection formation, resolving the contradiction between maintaining manufacturing efficiency and achieving required panel flatness.
2Manufacturing precision
If tension is applied to flatten warped panels, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The patent implements self-service by designing the carrier substrate with integrated tensioning features that automatically engage with the recesses in the encapsulant when the carrier is attached. The system self-regulates the tension application without requiring external complex mechanisms, thereby achieving panel flattening while minimizing process complexity.
3Manufacturing precision
If warpage control features are incorporated, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by incorporating warpage control recesses only in specific locations within the encapsulant material where they are most effective for tension distribution and panel flattening. This localized approach provides the necessary structural control while minimizing overall device complexity compared to uniform reinforcement throughout the entire panel structure.
Data Source
AI summary
A method of manufacturing a semiconductor device packaging panel is provided. The method includes forming a panel by placing a plurality of semiconductor die on a major side of a carrier substrate and encapsulating with an encapsulant the plurality semiconductor die and the major side of the carrier substrate. A plurality of warpage control features are formed with the encapsulant while encapsulating. The method further includes placing the panel onto a warpage control fixture to substantially flatten the panel. The plurality of warpage control features interlock with mating features of the warpage control fixture.