Semiconductor Chip Pad Arrangement for Miniaturization
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Solution Overview
Problem
The increasing number of external connection pads on semiconductor chips leads to a larger area, making miniaturization difficult due to concerns of short-circuiting and electrostatic discharge, and existing configurations that widen power supply-line pads do not allow for more integrated pads without degrading operating characteristics.
Innovation Solution
A semiconductor chip design with external connection pads arranged in a first and second pad group, where the first pad group has a smaller pitch and is connected to the same node, allowing for denser arrangement without causing short-circuiting issues, thereby reducing the chip's area without degrading operating characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of external connection pads is increased to support more input/output signals, then the functionality of the semiconductor device is improved, but the area of the semiconductor chip increases
Solution Approach 1:
The external connection pads are divided into two distinct groups: a first pad group with pads connected to the same node arranged at a first pitch, and a second pad group with pads connected to different nodes arranged at a second pitch. This segmentation allows each group to be optimized independently, enabling higher integration density for pads connected to the same node while maintaining adequate spacing for pads connected to different nodes, thus increasing the number of supported I/O signals without proportionally increasing chip area.
Solution Approach 2:
Different pitch values are applied to different groups of pads based on their connection characteristics. The first pad group uses a smaller pitch because all pads connect to the same node, making them functionally equivalent. The second pad group uses a larger pitch to account for the diversity of connections to different nodes. This local differentiation in pitch allocation optimizes space utilization while maintaining signal integrity.
2Area of stationary object
If the pitch between external connection pads is reduced to increase integration density, then the area of the semiconductor chip is reduced, but the risk of short-circuiting during fabrication increases
Solution Approach 1:
By segmenting pads into two groups with different pitch requirements, the invention allows the first pad group to use a smaller pitch without compromising reliability. Since all pads in the first group connect to the same node, reduced pitch does not increase short-circuit risk. The second pad group maintains a larger pitch to ensure adequate spacing for pads connected to different nodes, thus managing fabrication risks while optimizing overall area.
Solution Approach 2:
The pitch value is locally optimized for each pad group based on its specific connection characteristics. The first pad group accepts a smaller pitch because the uniform connection to the same node eliminates cross-talk and short-circuit risks between adjacent pads. The second pad group uses a larger pitch to maintain safety margins for diverse connections. This localized pitch optimization reduces overall chip area while maintaining fabrication reliability.
3Reliability
If power supply-line pads are widened to increase connection strength, then the reliability of power supply connections is improved, but the number of integratable pads is reduced
Solution Approach 1:
The invention segments power supply-related pads into the first pad group where multiple pads connect to the same power node. This segmentation allows these pads to be arranged with smaller pitch, increasing the total number of power supply pads that can be integrated. The connection strength is maintained through the collective effect of multiple closely-spaced pads rather than relying on individual pad size, thus improving both reliability and integration density.
Data Source
AI summary
A semiconductor chip having a core region and an I/O region which surrounds the core region is provided with a plurality of external connection pads connected to I/O cells. The plurality of external connection pads include a first pad group comprised of the external connection pads connected to the same node, and a second pad group comprised of the external connection pads connected to respective different nodes. In first and second pad groups, the external connection pads are arranged in an X direction along an external side of the semiconductor chip, and a pad arrangement pitch in the first pad group is smaller than that in the second pad group.