Semiconductor Package Contact-Pad Layout for Bonding Alignment
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Solution Overview
Problem
In semiconductor packaging, misalignment between contact-pads can occur during chip bonding, affecting device performance due to varying contact area sizes, leading to alignment issues and potential metal diffusion.
Innovation Solution
A semiconductor packaging structure is developed with a dielectric layer between chips, featuring contact-pads of inconsistent widths to ensure alignment accuracy and consistent contact areas, and the use of silicon-containing compounds to reduce packaging stress and metal diffusion, along with hybrid bond technology for improved integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If contact-pads of varying sizes are used during chip bonding, then manufacturing flexibility is improved, but alignment precision deteriorates
Solution Approach 1:
The patent changes the width parameter of contact-pads from variable to consistent. All second contact-pads are formed with the same width, which standardizes the bonding interface and improves alignment precision while maintaining manufacturing flexibility through the dielectric layer design
Solution Approach 2:
The dielectric layer acts as an intermediary between the first and second semiconductor chips. It provides a standardized platform for forming uniform contact-pads, mediating the bonding process to achieve both alignment precision and manufacturing flexibility
2Adaptability or versatility
If contact-pads of varying sizes are used during chip bonding, then device adaptability is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent standardizes the width parameter of all second contact-pads to be consistent. This uniform width ensures that contact areas between chips are consistent, improving manufacturing precision while device adaptability is maintained through the overall packaging structure design
Solution Approach 2:
The patent segments the bonding interface into standardized units with uniform contact-pad widths. This segmentation approach allows for consistent manufacturing precision across multiple chips while maintaining device adaptability through modular stacking
Data Source
AI summary
A semiconductor packaging structure and a method for forming the same are provided. A first semiconductor chip with first contact pads formed on a surface of the first semiconductor chip. A dielectric layer disposed on the first semiconductor chip with second contact pads formed in the dielectric layer. A second semiconductor chip stack structure disposed on the dielectric layer with third contact pads formed on the surface of the second semiconductor chip stack structure. The first semiconductor chip and the second semiconductor chip stacking structure are bonded to each other one-to-one by the first contact pads, the second contact pads and the third contact pads. a width of each of the second-contact-pads is not consistent with a width of each of corresponding first-contact-pads or a width of each of corresponding third-contact-pads.