Semiconductor Integrated Circuit Pad Bonding Configuration
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Solution Overview
Problem
Conventional semiconductor integrated circuits rely on fuse circuits to determine memory capacity, making it difficult to adjust product quantities in response to changing demand and reducing reliability due to the irreversible nature of fuse blowing.
Innovation Solution
A semiconductor integrated circuit that selectively supports different memory capacities and input/output modes using pad logic levels, eliminating the need for a fuse circuit by employing a pad bonding method to control column addresses and input/output configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fuse circuit is used to determine memory capacity, then product configuration is fixed, but adaptability to changing demand is reduced
Solution Approach 1:
The patent replaces the static fuse-based configuration with a dynamic pad bonding method that allows the semiconductor integrated circuit to adapt its memory capacity and input/output mode based on external signals. The pad bonding technique enables the circuit to be configured as X8-512M, X16-512M, or X16-256M by controlling the bonding state of specific pads during packaging, providing flexibility to respond to changing market demands while maintaining reliable operation.
2Ease of manufacture
If a fuse is blown to reduce memory capacity, then product type is defined, but the fuse cannot be restored
Solution Approach 1:
The patent applies preliminary action by configuring the memory capacity and input/output mode through pad bonding during the packaging process, before the product is shipped. This allows the desired configuration to be established in advance without irreversible fuse blowing, and the bonding state can be controlled precisely during manufacturing to achieve the required product type.
3Adaptability or versatility
If fuse blowing process is used, then product configuration is determined, but reliability is reduced due to potential problems during blowing
Solution Approach 1:
The patent extracts the configuration determination function from the fuse circuit and relocates it to the pad bonding process. By removing the fuse-based configuration mechanism and replacing it with pad bonding control, the reliability issues associated with fuse blowing are eliminated while maintaining the ability to configure different product types (X8-512M, X16-512M, X16-256M) through controlled pad bonding states.
Data Source
AI summary
A semiconductor integrated circuit includes a first pad allocated to receive a row address, a second pad allocated to discriminate a first input/output mode and a second input/output mode, a detector configured to generate a detection signal in response to logic levels of the first and second pads, and a column address controller configured to deassert a column address to a logic low level in response to a deasserted detection signal. The semiconductor integrated circuit may selectively support one of first and second memory capacities and one of the first and second input/output modes using the logic levels of the first and second pads.