Semiconductor Pad Sharing Wire Bonding and Bump Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor device manufacturing techniques face challenges in achieving compactness due to the need for separate pad regions for wire bonding and bump electrodes, leading to increased size and potential for corrosion or short circuits.
Innovation Solution
A method involving the formation of integrated circuits with specific wiring patterns and protective film openings allows for both wire bonding and bump electrode coupling using the same manufacturing process, sharing the manufacturing process and reducing the number of pad regions, and arranging bump electrodes to form equilateral triangles for compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate pad regions are provided for wire bonding and bump electrodes, then both coupling methods can be supported, but the chip size increases and manufacturing complexity increases
Solution Approach 1:
The patent applies universality by designing a single pad region that can serve both wire bonding and bump electrode coupling functions. The pad structure is configured to accommodate either coupling method, eliminating the need for separate dedicated regions for each method. This multi-functional design allows the same pad to be used depending on the chosen package structure, thereby reducing overall chip area while maintaining versatility.
Solution Approach 2:
The patent merges the previously separate pad regions for wire bonding and bump electrodes into a single integrated pad structure. By combining these functions into one region, the total area required is reduced, and the manufacturing process is simplified. The merged pad can be selectively coupled with either wire bonds or bump electrodes based on the desired package configuration.
2Adaptability or versatility
If separate pad regions are provided for wire bonding and bump electrodes, then both coupling methods can be supported, but the number of manufacturing processes and masks increases
Solution Approach 1:
The universal pad design allows a single manufacturing process and mask set to produce pads suitable for both wire bonding and bump electrode coupling. The same pad formation process creates structures that can accommodate either coupling method, eliminating the need for separate exclusive masks and additional processing steps for each package type.
Solution Approach 2:
Instead of creating different pad structures for different coupling methods and then selecting the appropriate one, the patent inverts the approach by designing a single pad structure that can accommodate both methods. This reversal simplifies the manufacturing workflow by eliminating the need to prepare separate process paths for wire bonding and bump electrode fabrication.
3Ease of operation
If junctions for wire bonding are always exposed, then wire bonding can be performed, but corrosion and short circuits between wire and bump electrodes may occur
Solution Approach 1:
The patent applies local quality by selectively exposing only the specific regions where wire bonding is required while keeping other areas protected. The pad structure is designed with localized exposure zones that provide adequate accessibility for wire bonding operations while maintaining coverage in areas where bump electrodes are present, thereby preventing corrosion and short circuits in those protected regions.
Solution Approach 2:
The patent uses the pad structure itself as an intermediary element that mediates between the need for wire bonding accessibility and the need for corrosion protection. The pad serves as a controlled interface that allows wire bonding where needed while providing protective coverage where bump electrodes are located, preventing direct exposure and potential corrosion of underlying structures.
Data Source
AI summary
A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.