Semiconductor Pad Cell Design for Wire Bond and Flip Chip Compatibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor chip manufacturing, the area used for supply pads in wire bond technology cannot be utilized for I/O pads in flip chip technology, leading to inefficient use of silicon and increased design efforts for different packaging types.
Innovation Solution
A semiconductor chip design where contact pads in the edge area are used for both supply and I/O functions, with pad cells including drivers or receivers, allowing the same semiconductor die to be used for both wire bond and flip chip technologies by reassigning pad functions in the top metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If supply pads are moved from the pad ring to the center of the chip for flip chip technology, then the chip area is reduced and I/O pads can be increased, but the silicon can no longer be used for wire bonding in QFP packages
Solution Approach 1:
The contact pads in the pad ring are designed to serve dual purposes: they can function as supply pads for wire bond technology (QFP packages) and as I/O pads for flip chip technology (BGA packages). This multi-functionality is achieved by configuring pad cells with drivers or receivers that can be selectively connected to contact pads based on the intended packaging technology, allowing the same silicon die to be used for both packaging types without modification
Solution Approach 2:
The patent implements dynamic configurability where the function of contact pads can be changed through selective connection of drivers and receivers in pad cells. By controlling which drivers/receivers are connected to which contact pads, the system can dynamically adapt between wire bond and flip chip configurations, enabling the same hardware to serve different functions based on packaging requirements
2Area of stationary object
If the pad ring area is reduced to optimize chip size, then manufacturing cost is reduced, but the design must be customized for different packaging types increasing design effort
Solution Approach 1:
The pad cells are designed with universal functionality to support both wire bond and flip chip packaging technologies. Each pad cell contains drivers and receivers that can be selectively connected to contact pads, allowing the same chip design to be used for different packaging types without requiring separate designs or modifications
Solution Approach 2:
The patent utilizes parameter changes in the electrical configuration of pad cells to achieve different packaging modes. By changing the connection state of drivers and receivers (electrical parameters) rather than physical structure, the system can adapt between packaging types, reducing design effort while maintaining optimized chip area
Data Source
AI summary
Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.