Semiconductor Pad Heat Dissipation via Conductive Contacts
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Solution Overview
Problem
Conventional semiconductor memory devices suffer from poor heat dissipation due to insulating layers with low thermal conductivity, which hampers their operating performance, especially in high-speed applications where heat generation increases.
Innovation Solution
The semiconductor device incorporates a structure with multiple contacts having high thermal conductivity, arranged in a matrix form under the pad to facilitate effective heat dissipation, replacing the low thermal conductivity insulating layers, and includes a method of forming these contacts and layers to enhance heat dissipation while maintaining the pad's functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating layers are used as dummy layers under the pad, then the step height is adjusted and stress is alleviated, but heat dissipation efficiency deteriorates due to low thermal conductivity
Solution Approach 1:
The patent applies local quality by using different materials with different properties in different regions. Specifically, insulating layers are used in regions where stress alleviation is needed, while highly conductive material layers are used in regions where heat dissipation is prioritized. This allows each region to have optimized properties for its specific function.
Solution Approach 2:
The patent employs composite materials by combining insulating layers with highly conductive material layers in a multi-layer structure under the pad. This composite structure simultaneously provides both stress alleviation (through the insulating layers) and efficient heat dissipation (through the highly conductive layers), resolving the contradiction between these two requirements.
2Stability of the object's composition
If insulating layers are interposed between dummy layers, then structural integrity is maintained, but thermal conductivity deteriorates
Solution Approach 1:
The patent applies local quality by strategically placing highly conductive material layers in specific positions within the dummy layer structure. These highly conductive layers are positioned to create thermal pathways while the insulating layers maintain structural integrity. This localized optimization allows the structure to simultaneously maintain stability and improve heat dissipation.
Solution Approach 2:
The patent uses highly conductive material layers as intermediary elements between the insulating layers. These intermediary layers serve as thermal bridges that conduct heat away from the pad while the insulating layers maintain the structural framework. The intermediary highly conductive layers mediate between the conflicting requirements of structural integrity and thermal conductivity.
3Ease of manufacture
If conventional pad structure with multiple insulating layers is used, then manufacturing process is simplified, but heat dissipation performance deteriorates
Solution Approach 1:
The patent applies parameter changes by modifying the material properties of the dummy layers. Instead of using only insulating materials, the patent introduces highly conductive materials with different thermal conductivity parameters. This change in material parameters enables efficient heat dissipation while the layering structure maintains compatibility with existing manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation from the semiconductor device, improving its operating performance by utilizing high thermal conductivity contacts to transmit heat away from the substrate, thus addressing the limitations of conventional devices.
Implementation Method 1
heat is not properly dissipated from the semiconductor memory device because the insulating layers have low thermal conductivity
Data Source
AI summary
A semiconductor device and method of forming a pad thereof are provided. The device includes: a substrate; at least one first active region disposed in a first region of the substrate; at least one second active region disposed in a second region adjacent to the first region of the substrate; a plurality of first contacts disposed on the second active region; a first insulating layer disposed on the first active region and between the first contacts; a poly layer disposed on the first contacts and the first insulating layer; a plurality of second contacts disposed on the poly layer in the second region; a second insulating layer disposed between the second contacts and on the poly layer in the first region; and a pad disposed on the second insulating layer and the second contacts.