Semiconductor Pad Crack Detection via Embedded Sensor
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Solution Overview
Problem
Conventional semiconductor devices are prone to cracks during fabrication, assembly, and operation, which can lead to IC failures due to mechanical stress, and existing methods lack effective crack detection mechanisms, especially before functional failures occur.
Innovation Solution
Incorporating an electrical conductive sensor structure connected to a sensor circuit below the pad of a semiconductor device to detect changes in electrical parameters indicative of cracks, allowing for early detection and prevention of chip failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical forces are applied during assembly process to connect die to lead frame, then electrical connections are established, but cracks form near or below pad contact surface
Solution Approach 1:
The patent applies preliminary action by placing a sensor structure below the pad contact surface before the assembly process. This sensor detects cracks as they form during soldering or bonding, enabling early detection before functional failures occur. The sensor is positioned to monitor the exact location where mechanical cracks typically develop during connection establishment.
Solution Approach 2:
The sensor structure acts as an intermediary element between the pad contact surface and the underlying substrate. It monitors mechanical stress and crack formation without interfering with the electrical connection process. The sensor provides indirect measurement of pad integrity through electrical parameter changes, allowing detection without direct mechanical intervention.
2Ease of operation
If mechanical forces are applied to carrier tapes during feeding process, then chip scale packaged units are positioned, but cracks form before assembly process
Solution Approach 1:
The sensor structure enables preliminary detection of cracks that form during carrier tape feeding and handling, before the actual assembly process begins. This allows defective units to be identified and removed early in the manufacturing flow, preventing further processing of cracked components.
3Productivity
If cracks are not detected during final test, then production proceeds, but devices fail in the field
Solution Approach 1:
The sensor structure provides real-time feedback during the assembly process about crack formation. This feedback mechanism allows immediate identification of defective units, enabling quality control decisions to be made during manufacturing rather than after field deployment. The electrical parameter changes detected by the sensor create a feedback loop that monitors pad integrity throughout the assembly process.
4Measurement precision
If sensor structure is placed below pad, then crack detection capability is improved, but device complexity increases
Solution Approach 1:
The sensor structure below the pad serves multiple functions: it detects cracks, monitors mechanical stress, and provides quality assurance data. This multi-functionality justifies the added complexity by delivering comprehensive monitoring capabilities from a single integrated structure rather than requiring multiple separate sensing systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables early detection of cracks before they affect electrical components, preventing chip failure and improving the reliability and testability of semiconductor devices by monitoring changes in voltage, current, or resistance.
Implementation Method 1
the sensor circuit is configured to detect a value or a change of a value of an electrical parameter associated with the electrical conductive sensor structure indicating a crack within proximity of the pad
Data Source
AI summary
A semiconductor device including an electrical conductive sensor structure connected to a sensor circuit. At least a part of the electrical conductive sensor structure is located below a pad of the semiconductor device. Further, the sensor circuit is configured to detect a value or a change of a value of an electrical parameter associated with the electrical conductive sensor structure indicating a crack within proximity of the pad.