Semiconductor Package Pad Layout for Compact High-Voltage Isolation
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Solution Overview
Problem
Semiconductor devices face challenges in achieving compactness without compromising dielectric strength, particularly in electrically-powered vehicles, where the compact design reduces the volume of sealing resin between low and high voltage sections, potentially lowering dielectric strength and causing wires to be too close to the insulating element during resin molding.
Innovation Solution
The semiconductor device incorporates a conductive support member with specific pad portions and edges configurations, where the first pad portion has a first edge adjacent to the second pad portion, and both have edges extending in perpendicular directions, allowing for a compact design while maintaining adequate insulation and preventing wires from being pushed too close to the insulating element during resin molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the volume of sealing resin is reduced to achieve a more compact semiconductor device, then the device size is reduced, but the dielectric strength between low voltage and high voltage sections is lowered
Solution Approach 1:
The patent transitions from planar spacing to three-dimensional spacing by having the first edge extend in a direction substantially perpendicular to the second edge. This vertical stacking arrangement increases the insulation distance in the thickness direction while maintaining a compact planar footprint, thus achieving both compactness and adequate dielectric strength.
Solution Approach 2:
The pad portions are designed with asymmetric edge arrangements where the first edge extends perpendicular to the second edge, creating an optimized spatial configuration. This asymmetric layout maximizes the insulation distance between voltage sections while minimizing the overall device volume.
2Volume of moving object
If wires are pushed closer to the insulating element during resin molding, then the device can be more compact, but the dielectric strength is reduced
Solution Approach 1:
The pad portions are pre-configured with specific edge extensions in perpendicular directions before resin molding. This preliminary structural arrangement ensures that even when wires are pushed during molding, the perpendicular edge configuration maintains adequate insulation distance and prevents wires from compromising dielectric strength.
3Volume of moving object
If the distance between low voltage and high voltage sections is reduced for compactness, then the device size is reduced, but the insulation effectiveness is compromised
Solution Approach 1:
The invention utilizes the thickness direction (perpendicular to the substrate plane) to increase insulation distance. By extending edges in perpendicular directions rather than relying solely on planar separation, the design achieves adequate insulation while maintaining compact planar dimensions.
Solution Approach 2:
The patent employs a composite structure combining planar pad portions with vertically extending edges, creating a multi-dimensional insulation barrier. This composite geometric configuration provides enhanced electrical isolation between voltage sections while minimizing overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact semiconductor device without lowering dielectric strength, ensuring effective insulation and preventing resin flow from pushing wires closer to the insulating element, thus maintaining the device's electrical integrity.
Implementation Method 1
One of the coils converts an electric signal transmitted from the control element into magnetic force. The other coil converts the magnetic force into an electric signal of a greater potential difference than the electric signal transmitted from the control element.
Implementation Method 2
The insulating element enables transmission of electric signals between the control element and the driver element that are electrically insulated from each other, so that the control element is protected from a relatively high voltage.
Data Source
AI summary
A semiconductor device includes a conductive support member, a control element, an insulating element, a driver element and a sealing resin. The conductive support member includes a first lead and a second lead. The first lead has a first pad portion. The second lead has a second pad portion. The second pad portion is adjacent to the first pad portion in a first direction perpendicular to a thickness direction of the first pad portion. The control element is mounted on the first pad portion. The insulating element is mounted on the first pad portion and electrically connected to the control element. The driver element is mounted on the second pad portion and electrically connected to the insulating element. The sealing resin covers the first pad portion, the second pad portion, the control element, the insulating element and the driver element. As viewed in the thickness direction, the first pad portion has a first edge adjacent to the second pad portion in the first direction and extending in a second direction perpendicular to the thickness direction and the first direction. The first edge has a first end and a second end opposite in the second direction. As viewed in the thickness direction, the second pad portion has a second edge adjacent to the first edge in the first direction and extending in the second direction. The second edge has a third end and a fourth end opposite in the second direction. One of the third end and the fourth end is located between the first end and the second end in the second direction.