Semiconductor Pad Structure for Electrical Misalignment Measurement

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Solution Overview

Problem

Current methods for measuring misalignment between substrates in semiconductor devices rely on laser microscopes, which are time-consuming and costly, and can reduce the yield of flip-chip connections if misalignment exceeds a specific range.

Innovation Solution

A semiconductor device with a measurement structure comprising conductive pads and a conductive member that allows for the measurement of misalignment without a laser microscope by determining the presence and amount of misalignment based on changes in electrical connection states, using measurement pads to assess conductivity between pads on overlapping substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a laser microscope is used to measure misalignment between alignment marks on substrates, then measurement precision is improved, but productivity deteriorates due to time-consuming measurement process

Engineering Contradiction:

Improvemisalignment measurement precisionVSAvoidmeasurement speed

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent replaces the optical measurement system (laser microscope) with an electrical measurement system. Conductive members are formed extending from alignment marks to measurement pads, allowing misalignment to be detected through electrical conductivity changes rather than optical imaging. This substitution enables rapid electrical measurements that determine misalignment based on whether conductive members contact underlying conductive layers, significantly improving measurement speed while maintaining precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If a laser microscope is used to measure misalignment, then measurement accuracy is improved, but manufacturing cost increases

Engineering Contradiction:

Improvemisalignment measurement accuracyVSAvoidmanufacturing cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent eliminates the need for expensive laser microscope equipment by using standard electrical measurement tools. The conductive members serve as both functional interconnects and measurement indicators, allowing misalignment detection through simple conductivity tests. This approach removes the requirement for specialized optical instrumentation, significantly reducing equipment investment and operational costs while maintaining measurement accuracy.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The conductive members serve dual purposes: they function as electrical interconnects between circuit elements and simultaneously serve as measurement indicators for misalignment detection. This multi-functionality eliminates the need for separate measurement structures or equipment, reducing overall manufacturing cost while maintaining measurement capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Measurement precision

If traditional alignment measurement methods are used, then measurement capability is maintained, but yield of flip-chip connections deteriorates due to extended measurement time

Engineering Contradiction:

Improvealignment measurement capabilityVSAvoidyield of flip-chip connection

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent replaces slow optical measurement with rapid electrical measurement. The conductive members create electrical pathways that can be quickly tested to determine misalignment status. This rapid feedback enables real-time adjustment during the flip-chip connection process, ensuring alignment remains within acceptable ranges and improving connection yield by preventing defective connections from occurring.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and cost-effective measurement of misalignment without the need for a laser microscope, reducing manufacturing time and costs while maintaining or improving yield by determining the correct alignment range for flip-chip connections.

Implementation Method 1

a conductive member that is provided on the substrate surface and electrically connects the plurality of first pads and the plurality of second pads

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250105062A1Semiconductor device and misalignment measurement method for semiconductor device

Publication Date: 2025.03.27 LAPIS SEMICON CO LTD

AI summary

There is provided a semiconductor device including: a first substrate and a second substrate mounted in an overlapping manner, wherein the first substrate includes: plural conductive first pads that are arranged on a substrate surface of the first substrate at intervals; plural conductive second pads that are arranged on the substrate surface at intervals; and a conductive member, and the second substrate includes: plural conductive third pads; plural conductive fourth pads; a first measurement pad that is measures whether or not the third pad is conductive with the fourth pad; and a second measurement pad that is checks whether or not the third pad is conductive with the fourth pad.