Semiconductor Pad Opening Structure for Moisture-Resistant Dense Mounting
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Solution Overview
Problem
The challenge in semiconductor devices is to improve mounting density while preventing moisture intrusion from through holes, which is hindered by the need for a metal ring structure that limits wiring pattern arrangement.
Innovation Solution
A semiconductor device design where the pad for external connection is positioned between the semiconductor layer and the wiring layer, with an insulating portion embedded in the semiconductor layer, and the outer edge of the insulating portion surrounds the pad, forming a wall surface with the semiconductor layer, thereby reducing the necessity for a metal ring structure and enhancing moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal ring structure is provided to surround the through hole, then moisture intrusion is suppressed, but the region to arrange the wiring pattern is limited, hindering improvement of mounting density
Solution Approach 1:
The invention extracts the moisture prevention function from the metal ring structure and transfers it to the pad structure itself. The pad is extended to expose a third surface that contacts the insulator, creating a moisture barrier without requiring a separate metal ring structure. This eliminates the space occupation by metal rings while maintaining moisture resistance.
Solution Approach 2:
The pad structure is given multiple functions: it serves as both an electrical connection element and a moisture barrier. By extending the pad to contact the insulator and form a wall surface with the opening portion, the pad simultaneously provides electrical connectivity and environmental protection, eliminating the need for separate dedicated moisture barrier structures.
2Productivity
If the pad is positioned between the semiconductor layer and wiring layer, then mounting density is improved, but moisture intrusion risk increases without additional protective structures
Solution Approach 1:
The insulator acts as an intermediary between the pad and the external environment. The pad's third surface contacts the insulator, and the insulator material provides moisture barrier properties. This intermediary structure protects the pad from moisture intrusion while allowing the pad to be positioned in the high-density configuration between layers.
Data Source
AI summary
A semiconductor device is provided. The device includes a semiconductor layer which forms a part of first and second surfaces respectively, a wiring structure arranged on the second surface, and a pad. An opening portion for exposing the pad is provided in the first surface. The pad is arranged between the first surface and a wiring layer closest to the second surface among wiring layers arranged in the wiring structure, and has a third surface which partially exposed by the opening portion. An insulating portion forming a part of the second surface is embedded in the semiconductor layer. An outer edge of the insulating portion is arranged so as to surround an outer edge of the pad. A wall surface of the opening portion is formed by the semiconductor layer and the insulating portion, or formed by the insulating portion.