Semiconductor Package Pad Layout for Multi-Stage Testing
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Solution Overview
Problem
Existing semiconductor device packaging methods fail to accommodate varying test demands during different manufacturing process stages, lacking flexibility and increasing production cycle and cost.
Innovation Solution
A package structure and method that integrates both top metal layer and redistribution layer windowing, allowing for different types of tests by forming a first pad for low-speed tests, reducing its area to form a fourth pad, and then adding a redistribution layer with second and third pads for high-speed tests, connected via conductive pillars for improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a large area first pad is formed for low-speed testing, then testing capability is provided, but parasitic capacitance increases and area is wasted
Solution Approach 1:
The pad structure is made dynamic through a two-stage configuration: initially forming a large area first pad for low-speed testing, then selectively removing portions to create a smaller fourth pad for high-speed testing. This dynamic transformation allows the same structure to adapt to different testing requirements, providing versatility while minimizing parasitic capacitance in the final configuration.
Solution Approach 2:
The testing process is segmented into two distinct stages: low-speed testing using the first pad, and high-speed testing using the fourth pad. By dividing the testing functionality into separate phases with different pad configurations, the invention optimizes performance for each testing type while reducing overall parasitic capacitance compared to maintaining a single large pad throughout.
2Adaptability or versatility
If both first type and second type tests are accommodated in the same package structure, then testing flexibility is improved, but device complexity increases
Solution Approach 1:
The package structure achieves multi-functionality by integrating both first type test and second type test capabilities within a single structure. The first pad serves dual purposes: initially for low-speed testing, then after modification for high-speed testing. This universal design eliminates the need for separate testing structures, maintaining flexibility while controlling complexity through shared infrastructure.
Solution Approach 2:
The invention utilizes parameter changes in the pad configuration to accommodate different test types. By modifying the pad area from the initial first pad to the reduced fourth pad, and by forming conductive pillars with specific dimensions, the structure adapts its electrical characteristics to suit different testing requirements without requiring fundamentally different structures for each test type.
3Ease of manufacture
If conventional packaging methods are used, then manufacturing process is simple, but production cycle is extended and cost increases
Solution Approach 1:
The invention applies preliminary action by forming the first pad and conducting first type tests before finalizing the pad structure. This early testing capability allows for process optimization and defect detection earlier in manufacturing, potentially reducing rework and accelerating overall production despite the additional initial steps.
Solution Approach 2:
The manufacturing process maintains continuity by seamlessly transitioning from first pad formation to first type testing, then to pad modification and fourth pad formation. Rather than completing all structure formation before any testing, the continuous integration of testing activities throughout the manufacturing process reduces idle time and accelerates production cycles.
Data Source
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AI summary
Embodiments of disclosure provide a package structure, a packaging method and a semiconductor device. The packaging method includes: providing a semiconductor functional structure, in which an interconnecting layer is disposed on a surface of the semiconductor functional structure; forming an isolation layer exposing part of the interconnecting layer, in which the exposed part of the interconnecting layer acts as a first pad, and the first pad is used for performing a first type test; after completing the first type test, forming a redistribution layer on the first pad and the isolation layer, in which the redistribution layer and the interconnecting layer are electrically connected; and forming a first insulating layer exposing parts of the redistribution layer, in which the exposed parts of the redistribution layer act as a second pad and a third pad, the second pad is used for performing a second type test, and the third pad is used for executing a functional interaction corresponding to contents of the second type test, wherein a running speed of the semiconductor functional structure when performing the first type test is lower than a running speed when performing the second type test.